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参数资料
| 型号： | ISL6401CRZ-T |
| 厂商： | Intersil |
| 文件页数： | 3/11页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BST FLYBK ISO 16QFN |
| 标准包装： | 6,000 |
| PWM 型： | 电流模式 |
| 输出数： | 1 |
| 频率 - 最大： | 600kHz |
| 占空比： | 50% |
| 电源电压： | 4.5 V ~ 5.5 V |
| 降压： | 无 |
| 升压： | 是 |
| 回扫： | 是 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 16-VQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
ISL6401
Absolute Maximum Ratings
Supply Voltage, V CC, PV CC . . . . . . . . . . . . . . . . GND -0.3V to +7.0V
PGND to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 0.3V
Peak GATE Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1A
ESD Classification . . . . . . . . . . . . . . . . . . . . . Class 1 (HBM, 2500V)
NFB Pin Voltage. . . . . . . . . . . . . . . . . . . . . . ±10V (Transient, 10ms)
Operating Conditions
Temperature Range
Thermal Information
Thermal Resistance (Typical) θ JA (°C/W) θ JC (°C/W)
14 Lead SOIC (Note 6) . . . . . . . . . . . . 90 NA
16 Lead QFN (Note 7) . . . . . . . . . . . . . 46 9
Maximum Junction Temperature (Plastic Package) . -55°C to 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
For Recommended soldering conditions see Tech Brief TB389.
ISL6401C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Supply Voltage Range (Typical). . . . . . . . . . . . . . . . . . . . . 5V ± 10%
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
6. θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
7. θ JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. θ JC, the
“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
8. All voltages are with respect to GND.
Electrical Specifications
Recommended operating conditions unless otherwise noted. Refer to Block Diagram and Typical Application
schematic. V CC = +5.0V ±10%, T A = -40 to 85°C (Note 9), Typical values are at T A = 25°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
V CC SUPPLY
Supply Voltage Range
4.5
5.0
5.5
V
Shutdown Supply Current
Start-Up Current
Operating Supply Current
SHDN = GND
V CC < 3.7V
(Note 10)
-
-
-
55
0.1
3.7
100
0.20
6.0
μ A
mA
mA
REFERENCE VOLTAGE
Output Voltage
1.237
1.25
1.262
V
Long Term Stability
T A = 125°C, 1000 hours
-
5
-
mV
NEGATIVE FEEDBACK
Source Current
-
1.0
2.0
mA
CURRENT SENSE
Maximum Input Signal
Input Bias Current
Overcurrent Threshold
0.2
-2.0
0.4
0.260
0.0
0.52
0.3
2.0
0.6
V
μ A
V
ERROR AMPLIFIER
Open Loop Voltage Gain
Gain-Bandwidth Product
Input Voltage
Input Bias Current
-
10
1.225
-
78
-
1.25
1.0
-
-
1.275
-
dB
MHz
V
μ A
PWM
Maximum Duty Cycle
47
48
50
%
Minimum Duty Cycle
COMP = 0V
-
0
-
%
UNDERVOLTAGE LOCKOUT
Start Threshold
Stop Threshold
3.7
3.2
4.1
3.6
4.3
4.0
V
V
3
FN9007.7
April 13, 2005
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