参数资料
型号: ISL6522IBZ-T
厂商: Intersil
文件页数: 14/15页
文件大小: 0K
描述: IC REG CTRLR BST PWM VM 14-SOIC
标准包装: 2,500
PWM 型: 电压模式
输出数: 1
频率 - 最大: 1MHz
占空比: 100%
电源电压: 10.8 V ~ 13.2 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 85°C
封装/外壳: 14-SOIC(0.154",3.90mm 宽)
包装: 带卷 (TR)
ISL6522
Thin Shrink Small Outline Plastic Packages (TSSOP)
N
M14.173
INDEX
AREA
E1
-B-
E
0.25(0.010) M
GAUGE
PLANE
B M
14 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
INCHES MILLIMETERS
SYMBOL MIN MAX MIN MAX
NOTES
1
2
3
A
-
0.047
-
1.20
-
-A-
0.05(0.002)
D
SEATING PLANE
A
0.25
0.010
L
A1
A2
b
0.002
0.031
0.0075
0.006
0.051
0.0118
0.05
0.80
0.19
0.15
1.05
0.30
-
-
9
c
0.0035
0.0079
0.09
0.20
-
e
b
0.10(0.004) M
-C-
C A M
B S
A1
α
0.10(0.004)
A2
c
D
E1
e
E
L
0.195 0.199
0.169 0.177
0.026 BSC
0.246 0.256
0.0177
0.0295
4.95 5.05
4.30 4.50
0.65 BSC
6.25 6.50
0.45
0.75
3
4
-
-
6
NOTES:
1. These package dimensions are within allowable dimensions of
N
α
0 o
14
8 o
0 o
14
8 o
7
-
JEDEC MO-153-AC, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
14
Rev. 1 6/00
FN9030.8
March 10, 2006
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