参数资料
型号: ISL6613CBZ-T
厂商: Intersil
文件页数: 11/12页
文件大小: 0K
描述: IC MOSFET DRVR SYNC BUCK 8-SOIC
标准包装: 2,500
配置: 高端和低端,同步
输入类型: PWM
延迟时间: 10ns
电流 - 峰: 1.25A
配置数: 1
输出数: 2
高端电压 - 最大(自引导启动): 36V
电源电压: 10.8 V ~ 13.2 V
工作温度: 0°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 带卷 (TR)
ISL6612, ISL6613
Small Outline Exposed Pad Plastic Packages (EPSOIC)
N
M8.15B
INDEX
AREA
E
-B-
H
0.25(0.010) M
B M
8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD
PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
1
2
3
A
0.056
0.066
1.43
1.68
-
TOP VIEW
SEATING PLANE
L
A1
B
C
D
E
0.001
0.0138
0.0075
0.189
0.150
0.005
0.0192
0.0098
0.196
0.157
0.03
0.35
0.19
4.80
3.81
0.13
0.49
0.25
4.98
3.99
-
9
-
3
4
-A-
D
A
h x 45 o
e
H
0.050 BSC
0.230
0.244
1.27 BSC
5.84
6.20
-
-
e
B
0.25(0.010) M
SIDE VIEW
-C-
C A M B S
A1
α
0.10(0.004)
C
h
L
N
α
P
P1
0.010
0.016
-
-
8
0.016
0.035
0.094
0.094
0.25
0.41
-
-
8
0.41
0.64
2.387
2.387
5
6
7
-
11
11
Rev. 4 1/09
NOTES:
1
2
3
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
N
P
BOTTOM VIEW
P1
11
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: INCH. Converted millimeter dimensions
are not necessarily exact.
11. Dimensions “P” and “P1” are thermal and/or electrical enhanced
variations. Values shown are maximum size of exposed pad
within lead count and body size.
FN9153.9
June 15, 2010
相关PDF资料
PDF描述
MIC2800-A4SYML TR IC REG TRPL BUCK/LINEAR 16MLF
T491B107K006AT CAP TANT 100UF 6.3V 10% 1411
RSM40DTMH-S189 CONN EDGECARD 80POS R/A .156 SLD
RMM03DSEN CONN EDGECARD 6POS .156 EYELET
MIC2810-CGJYML TR IC REG TRPL BUCK/LINEAR 16-MLF
相关代理商/技术参数
参数描述
ISL6613CBZ-TR5214 功能描述:IC MOSFET DRVR SYNC BUCK 8-SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - MOSFET,电桥驱动器 - 外部开关 系列:- 标准包装:6,000 系列:*
ISL6613CR 功能描述:IC MOSFET DRVR SYNC BUCK 10-DFN RoHS:否 类别:集成电路 (IC) >> PMIC - MOSFET,电桥驱动器 - 外部开关 系列:- 标准包装:50 系列:- 配置:低端 输入类型:非反相 延迟时间:40ns 电流 - 峰:9A 配置数:1 输出数:1 高端电压 - 最大(自引导启动):- 电源电压:4.5 V ~ 35 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:TO-263-6,D²Pak(5 引线+接片),TO-263BA 供应商设备封装:TO-263 包装:管件
ISL6613CR-T 功能描述:IC MOSFET DRVR SYNC BUCK 10-DFN RoHS:否 类别:集成电路 (IC) >> PMIC - MOSFET,电桥驱动器 - 外部开关 系列:- 标准包装:50 系列:- 配置:低端 输入类型:非反相 延迟时间:40ns 电流 - 峰:9A 配置数:1 输出数:1 高端电压 - 最大(自引导启动):- 电源电压:4.5 V ~ 35 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:TO-263-6,D²Pak(5 引线+接片),TO-263BA 供应商设备封装:TO-263 包装:管件
ISL6613CRZ 功能描述:IC MOSFET DRVR SYNC BUCK 10-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - MOSFET,电桥驱动器 - 外部开关 系列:- 标准包装:50 系列:- 配置:高端 输入类型:非反相 延迟时间:200ns 电流 - 峰:250mA 配置数:1 输出数:1 高端电压 - 最大(自引导启动):600V 电源电压:12 V ~ 20 V 工作温度:-40°C ~ 125°C 安装类型:通孔 封装/外壳:8-DIP(0.300",7.62mm) 供应商设备封装:8-DIP 包装:管件 其它名称:*IR2127
ISL6613CRZ-T 功能描述:IC MOSFET DRVR SYNC BUCK 10-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - MOSFET,电桥驱动器 - 外部开关 系列:- 标准包装:6,000 系列:*