参数资料
型号: ISL78307FBEAZ
厂商: Intersil
文件页数: 7/9页
文件大小: 0K
描述: IC REG LDO 3.3V 50MA 8SOIC
标准包装: 98
稳压器拓扑结构: 正,固定式
输出电压: 3.3V
输入电压: 6 V ~ 40 V
电压 - 压降(标准): 0.13V @ 50mA
稳压器数量: 1
电流 - 输出: 50mA(最小)
电流 - 限制(最小): 60mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm Width)裸露焊盘
供应商设备封装: 8-SOIC-EP
包装: 托盘
ISL78307
Functional Description
Functional Overview
The ISL78307 is a high performance, high voltage, low-dropout
regulator (LDO) with 50mA sourcing capability. The part is
Output Voltage Setting
For the adjustable version of the ISL78307, the output voltage is
programmed using an external resistor divider as shown in
Figure 12.
qualified to operate over the -40°C to +125°C automotive
IN
OUT
temperature range. Featuring ultra-low quiescent current, it
makes an ideal choice for “always-on” automotive applications. It
works well under a “load dump condition” where the input
voltage could rise up to 40V. The LDO continues to operate down
to 3V under a “cold-crank” condition. The device also features
current limit and thermal shutdown protection.
Enable Control
C IN
0.1μF
R1
EN
ADJ
(ISL78307)
R2
GND
FIGURE 12. ADJUSTABLE VERSION
C OUT
10μF
The ISL78307 features an enable pin. When it is pulled low, the
V OUT = 1.223V × ? ------- + 1 ?
IC goes to a shutdown mode. In this condition, the device draws
less than 2μA. Driving the pin high turns the device on.
Current Limit Protection
The output voltage is calculated using Equation 1:
? R 1 ?
? R 2 ?
(EQ. 1)
The ISL78307 has internal current limit functionality to protect
the regulator during fault conditions. During current limit, the
output sources a fixed amount of current largely independent of
the output voltage. If the short or overload is removed from V OUT ,
the output returns to normal voltage regulation mode.
Power Dissipation
The junction temperature must not exceed the range specified in
dissipation can be calculated using Equation 2:
Thermal Fault Protection
P D = ( V IN – V OUT ) × I OUT + V IN × I GND
(EQ. 2)
Δ T J = T J ( MAX ) – T A ( MAX )
T J ( MAX ) = P D ( MAX ) x θ JA + T A
In the event the die temperature exceeds typically +165°C, the
output of the LDO will shut down until the die temperature cools
down to typically +145°C. The level of power dissipated,
combined with the ambient temperature and the thermal
impedance of the package, will determine if the junction
temperature exceeds the thermal shutdown temperature. Also
see the section on “Power Dissipation”.
Application Information
Input and Output Capacitors
For the output, a ceramic capacitor (X5R or X7R) with a
capacitance of 10μF is recommended for the ISL78307 to
maintain stability. The ground connection of the output capacitor
should be routed directly to the GND pin of the device and also
placed close to the IC. A minimum of 0.1μF (X5R or X7R) is
recommended at the input.
7
The maximum allowable junction temperature, T J(MAX) and the
maximum expected ambient temperature, T A(MAX) will determine
the maximum allowable junction temperature rise ( Δ T J ), as shown
in Equation 3:
(EQ. 3)
To calculate the maximum ambient operating temperature, use
the junction-to-ambient thermal resistance ( θ JA ) as shown in
Equation 4:
(EQ. 4)
Board Layout Recommendations
A good PCB layout is important to achieve expected
performance. Consideration should be taken when placing the
components and routing the trace to minimize the ground
impedance, and keep the parasitic inductance low. The input and
output capacitors should have a good ground connection and be
placed as close to the IC as possible. The feedback trace in the
adjustable version should be away from other noisy traces.
Connect EPAD to the ground plane for better heat dissipation.
Thermal vias on the EPAD increase heat dissipation.
FN7658.2
December 7, 2013
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