参数资料
型号: ISL78307FBECZ
厂商: Intersil
文件页数: 9/9页
文件大小: 0K
描述: IC REG LDO ADJ 50MA 8SOIC
标准包装: 98
稳压器拓扑结构: 正,可调式
输出电压: 2.5 V ~ 12 V
输入电压: 6 V ~ 40 V
电压 - 压降(标准): 0.12V @ 50mA
稳压器数量: 1
电流 - 输出: 50mA(最小)
电流 - 限制(最小): 60mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm Width)裸露焊盘
供应商设备封装: 8-SOIC-EP
包装: 托盘
ISL78307
Small Outline Exposed Pad Plastic Packages (EPSOIC)
N
M8.15B
INDEX
AREA
E
H
0.25(0.010) M
B M
8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD
PLASTIC PACKAGE
INCHES
MILLIMETERS
-B-
SYMBOL
MIN
MAX
MIN
MAX
NOTES
1
2
3
A
0.056
0.066
1.43
1.68
-
A1
0.001
0.005
0.03
0.13
-
TOP VIEW
SEATING PLANE
L
B
C
D
E
0.0138
0.0075
0.189
0.150
0.0192
0.0098
0.196
0.157
0.35
0.19
4.80
3.81
0.49
0.25
4.98
3.99
9
-
3
4
-A-
D
A
h x 45 o
e
H
0.050 BSC
0.230
0.244
1.27 BSC
5.84
6.20
-
-
-C-
α
h
0.010
0.016
0.25
0.41
5
e
B
0.25(0.010) M
C A M
B S
A1
0.10(0.004)
C
L
N
α
0.016
8
0.035
0.41
8
0.89
6
7
-
P
-
0.094
-
2.387
11
SIDE VIEW
P1
-
0.094
-
2.387
11
Rev. 5 8/10
NOTES:
1
2
3
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
N
P
BOTTOM VIEW
P1
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: INCH. Converted millimeter dimensions
are not necessarily exact.
11. Dimensions “P” and “P1” are thermal and/or electrical enhanced
variations. Values shown are maximum size of exposed pad
within lead count and body size.
For additional products, see www.intersil.com/en/products.html
Intersil Automotive Qualified products are manufactured, assembled and tested utilizing TS16949 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
9
FN7658.2
December 7, 2013
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