参数资料
型号: ISL80101IRAJZ-T
厂商: Intersil
文件页数: 9/11页
文件大小: 0K
描述: IC REG LDO ADJ 1A 10DFN
产品培训模块: Patient Monitoring and Diagnostic Equipment Solutions
标准包装: 6,000
稳压器拓扑结构: 正,可调式
输出电压: 0.8 V ~ 5 V
输入电压: 2.2 V ~ 6 V
电压 - 压降(标准): 0.13V @ 1A
稳压器数量: 1
电流 - 输出: 1A(最小值)
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 10-VFDFN 裸露焊盘
供应商设备封装: 10-DFN(3x3)
包装: 带卷 (TR)
ISL80101
Additional capacitors of any value in ceramic, POSCAP,
alum/tantalum electrolytic types may be placed in parallel to
improve PSRR at higher frequencies and/or load transient AC
output voltage tolerances.
INPUT CAPACITOR
For proper operation, a minimum capacitance of 10μF X5R/X7R
is required at the input. This ceramic input capacitor must be
49
47
45
43
connected to the V IN and GND pins of the LDO with PCB traces no
longer than 0.5cm.
Power Dissipation and Thermals
The junction temperature must not exceed the range specified in
41
39
37
2
4 6 8 10 12 14 16 18 20 22
EPAD-MOUNT COPPER LAND AREA ON PCB, mm 2
24
P D = ( V IN – V OUT ) × I OUT + V IN × I GND
P D ( MAX ) = ( T J ( MAX ) – T A ) ? θ JA
page 4. The power dissipation can be calculated by using
Equation 3:
(EQ. 3)
The maximum allowable junction temperature, T J(MAX) and the
maximum expected ambient temperature, T A(MAX) determine the
maximum allowable power dissipation, as shown in Equation 4:
(EQ. 4)
θ JA is the junction-to-ambient thermal resistance.
For safe operation, enure that the power dissipation P D ,
calculated from Equation 3, is less than the maximum allowable
power dissipation P D(MAX) .
The DFN package uses the copper area on the PCB as a heat-sink.
The EPAD of this package must be soldered to the copper plane
(GND plane) for effective heat dissipation. Figure 16 shows a curve
for the θ JA of the DFN package for different copper area sizes.
9
FIGURE 16. 3mmx3mm-10 PIN DFN ON 4-LAYER PCB WITH
THERMAL VIAS θ JA vs EPAD-MOUNT COPPER LAND
AREA ON PCB
Thermal Fault Protection
The power level and the thermal impedance of the package
(+45°C/W for DFN) determine when the junction temperature
exceeds the thermal shutdown temperature. In the event that the
die temperature exceeds around +160°C, the output of the LDO will
shut down until the die temperature cools down to about +130°C.
Current Limit Protection
The ISL80101 LDO incorporates protection against overcurrent due
to any short or overload condition applied to the output pin. The LDO
performs as a constant current source when the output current
exceeds the current limit threshold noted in the “Electrical
Specifications” table on page 4. If the short or overload condition is
removed from V OUT , then the output returns to normal voltage
regulation mode. In the event of an overload condition, the LDO may
begin to cycle on and off due to the die temperature exceeding
thermal fault condition and subsequently cooling down after the
power device is turned off.
FN6931.1
August 31, 2011
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