参数资料
型号: ISL8033IRZ-T
厂商: Intersil
文件页数: 16/18页
文件大小: 0K
描述: IC REG BUCK SYNC ADJ 3A DL 24QFN
标准包装: 6,000
类型: 降压(降压)
输出类型: 可调式
输出数: 2
输出电压: 0.8 V ~ 6 V
输入电压: 2.85 V ~ 6 V
PWM 型: 电流模式
频率 - 开关: 1.1MHz
电流 - 输出: 3A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 24-VFQFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 24-QFN(4x4)
ISL8033, ISL8033A
relative to the internal reference voltage and feed it back to the
inverting input of the error amplifier. Refer to Figure 2.
The output voltage programming resistor, R 2 (or R 5 in Channel
2), will depend on the desired output voltage of the regulator. The
value for the feedback resistor is typically between 0 Ω and
750k Ω . Let R 2 = 124k Ω , then R 3 will be:
V OUT – 0.8V
R 2 x0.8V
R 3 = -------------------------------
(EQ. 2)
For better performance, add 12pF in parallel to R 2 . If the output
voltage desired is 0.8V, then leave R 3 unpopulated and short R 2 .
Input Capacitor Selection
The main functions for the input capacitor is to provide
decoupling of the parasitic inductance and to provide filtering
function to prevent the switching current flowing back to the
battery rail. One 22μF X5R or X7R ceramic capacitor is a good
starting point for the input capacitor selection per channel.
PCB Layout Recommendation
The PCB layout is a very important converter design step to make
sure the designed converter works well. For ISL8033, the power
loop is composed of the output inductor L’s, the output capacitor
C OUT1 and C OUT2 , the LX’s pins, and the SGND pin. It is
necessary to make the power loop as small as possible and the
connecting traces among them should be direct, short and wide.
The switching node of the converter, the LX_ pins, and the traces
connected to the node are very noisy, so keep the voltage
feedback trace away from these noisy traces. The input capacitor
should be placed as closely as possible to the VIN pin . Also, the
ground of the input and output capacitors should be connected
as closely as possible. The heat of the IC is mainly dissipated
through the thermal pad. Maximizing the copper area connected
to the thermal pad is preferable. In addition, a solid ground plane
is helpful for better EMI performance. It is recommended to add
at least 5 vias ground connection within the pad for the best
thermal relief.
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
16
FN6854.2
March 24, 2011
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