参数资料
| 型号： | ISL83088EIU-T |
| 厂商： | Intersil |
| 文件页数： | 8/19页 |
| 文件大小： | 0K |
| 描述： | IC TXRX RS485/422 5V ESD 8-MSOP |
| 标准包装： | 2,500 |
| 类型： | 收发器 |
| 驱动器/接收器数： | 1/1 |
| 规程： | RS422，RS485 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 带卷 (TR) |
16
FN6085.9
April 22, 2008
ISL83080E, ISL83082E, ISL83083E, ISL83084E, ISL83085E, ISL83086E, ISL83088E
Mini Small Outline Plastic Packages (MSOP)
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane.
Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums
and
to be determined at Datum plane
.
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only.
L
0.25
(0.010)
L1
R1
R
4X
θ
4X
θ
GAUGE
PLANE
SEATING
PLANE
E
E1
N
12
TOP VIEW
INDEX
AREA
-C-
-B-
0.20 (0.008)
A
B C
SEATING
PLANE
0.20 (0.008)
C
0.10 (0.004)
C
-A-
-H-
SIDE VIEW
b
e
D
A
A1
A2
-B-
END VIEW
0.20 (0.008)
C
D
E1
CL
C
a
- H -
-A -
- B -
- H -
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.010
0.014
0.25
0.36
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
e
0.026 BSC
0.65 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
L1
0.037 REF
0.95 REF
-
N8
8
7
R
0.003
-
0.07
-
R1
0.003
-
0.07
-
0
5o
15o
5o
15o
-
α
0o
6o
0o
6o
-
Rev. 2 01/03
相关PDF资料 |
PDF描述 |
|---|---|
| ISL83220EIV-T | IC 1DRVR/1RCVR RS232 16-TSSOP |
| ISL83384ECA-T | IC 2DRVR/2RCVR RS232 3V 20-SSOP |
| ISL83385EIB-T | IC 2DRVR/2RCVR RS232 3V 18-SOIC |
| ISL83386EIV-T | IC 3DRVR/2RCVR RS232 3V 20-TSSOP |
| ISL83387EIV-T | IC 3DRVR/3RCVR RS232 3V 24-TSSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL83088EIUZ | 功能描述:RS-422/RS-485 接口 IC W/ANNEAL RS-485 ISL8 1/2 DUPLX 3V 8MS RoHS:否 制造商:Maxim Integrated 数据速率:1136 Kbps 工作电源电压:3 V to 5.5 V 电源电流:5.9 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-28 封装:Tube |
| ISL83088EIUZ-T | 功能描述:RS-422/RS-485 接口 IC W/ANNEAL RS-485 ISL8 1/2 DUPLX 3V 8MS RoHS:否 制造商:Maxim Integrated 数据速率:1136 Kbps 工作电源电压:3 V to 5.5 V 电源电流:5.9 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-28 封装:Tube |
| ISL83200CBZ | 制造商:Intersil Corporation 功能描述: |
| ISL83200CBZ-T | 制造商:Intersil Corporation 功能描述:RS-232 TRANSMITTERS/RECEIVERS |
| ISL83202 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:55V, 1A Peak Current H-Bridge FET Driver |
发布紧急采购，3分钟左右您将得到回复。