参数资料
| 型号： | ISL83387EIV |
| 厂商： | Intersil |
| 文件页数： | 5/13页 |
| 文件大小： | 0K |
| 描述： | IC TXRX RS-232 ESD 24-TSSOP |
| 标准包装： | 62 |
| 类型： | 收发器 |
| 驱动器/接收器数： | 3/3 |
| 规程： | RS232 |
| 电源电压： | 3 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 24-TSSOP |
| 包装： | 管件 |
| 产品目录页面： | 1242 (CN2011-ZH PDF) |
13
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6040.1
July 8, 2005
ISL83387E
Thin Shrink Small Outline Plastic Packages (TSSOP)
α
INDEX
AREA
E1
D
N
12
3
-B-
0.10(0.004)
C A
M
BS
e
-A-
b
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
c
E
0.25(0.010)
B
M
L
0.25
0.010
GAUGE
PLANE
A2
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AD, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
0.05(0.002)
M24.173
24 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.051
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.303
0.311
7.70
7.90
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
0.65 BSC
-
E
0.246
0.256
6.25
6.50
-
L
0.0177
0.0295
0.45
0.75
6
N24
24
7
α
0o
8o
0o
8o
-
Rev. 0 6/98
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相关代理商/技术参数 |
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|---|---|
| ISL83387EIV-T | 功能描述:IC 3DRVR/3RCVR RS232 3V 24-TSSOP RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:25 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:4.5 V ~ 5.5 V 安装类型:通孔 封装/外壳:16-DIP（0.300"，7.62mm） 供应商设备封装:16-PDIP 包装:管件 |
| ISL83387EIVZ | 功能描述:RS-232接口集成电路 W/ANNEAL RS232 3V 3D /3R 15KV SHTDWN 24LD RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
| ISL83387EIVZ-T | 功能描述:IC 3DRVR/3RCVR RS232 3V 24-TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:250 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:带卷 (TR) |
| ISL83483 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:3.3V, Low Power, High Speed or Slew Rate Limited, RS-485/RS-422 Transceivers |
| ISL83483_04 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:3.3V, Low Power, High Speed or Slew Rate Limited, RS-485/RS-422 Transceivers |
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