
3
FN6038.3
March 13, 2006
Absolute Maximum Ratings
Thermal Information
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V
V- to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -15 to 0.3V
All Other Pins (Note 2) . . . . . . . . . . . . . ((V-) - 0.3V) to ((V+) + 0.3V)
Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA
Peak Current, IN, NO, NC, or COM
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . 100mA
ESD Rating (Per MIL-STD-883 Method 3015). . . . . . . . . . . . . .>2kV
Operating Conditions
Temperature Range
ISL8394IX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
Thermal Resistance (Typical, Note 3)
θJA (°C/W)
20 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
95
Maximum Junction Temperature (Plastic Package). . . . . . . . 150°C
Moisture Sensitivity (See Technical Brief TB363)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. Signals on NC, NO, COM, or IN exceeding V+ or V- are clamped by internal diodes. Limit forward diode current to maximum current ratings.
3.
θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications: ±5V Supply Test Conditions: VSUPPLY = ±4.5V to ±5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 4),
Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
TEMP
(°C)
(NOTE 5)
MIN
TYP
(NOTE 5)
MAX
UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
Full
V-
-
V+
V
ON Resistance, RON
VS = ±4.5V, ICOM = 10mA, VNO or VNC = ±3.5V,
(See Figure 5)
25
-
17
35
Full
-
45
RON Matching Between Channels,
RON
VS = ±5V, ICOM = 10mA, VNO or VNC = ±3V
25
-
0.5
2
Full
-
4
RON Flatness, RFLAT(ON)
VS = ±5V, ICOM = 10mA, VNO or VNC = ±3V, 0V,
(Note 7)
25
-
4
Full
-
6
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
VS = ±5.5V, VCOM = ±4.5V, VNO or VNC = +4.5V,
(Note 6)
25
-0.2
-
0.2
nA
Full
-2.5
-
2.5
nA
COM ON Leakage Current,
ICOM(ON)
VS = ±5.5V, VCOM = VNO or VNC = ±4.5V, (Note 6)
25
-0.4
-
0.4
nA
Full
-5
-
5
nA
DIGITAL INPUT CHARACTERISTICS
Input Voltage High, VINH
Full
2.4
-
V
Input Voltage Low, VINL
Full
-
0.8
V
Input Current, IINH, IINL
VS = ±5.5V, VIN = 0V or V+
Full
-1
1
A
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
VS = ±4.5V, VNO or VNC = ±3V, RL = 300, CL = 35pF,
VIN = 0 to 3V, (See Figure 1)
25
-
50
130
ns
Full
-
175
ns
Turn-OFF Time, tOFF
VS = ±4.5V, VNO or VNC = ±3V, RL = 300, CL = 35pF,
VIN = 0 to 3V, (See Figure 1)
25
-
30
75
ns
Full
-
100
ns
Break-Before-Make Time Delay, tD
VS = ±5.5V, VNO or VNC = 3V, RL = 300, CL = 35pF,
VIN = 0 to 3V, (See Figure 3)
25
2
10
-
ns
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0, (See Figure 2)
25
-
5
10
pC
NO OFF Capacitance, COFF
f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 7)
25
-
12
-
pF
ISL8394