参数资料
型号: ISL84581IVZ-T
厂商: Intersil
文件页数: 6/15页
文件大小: 0K
描述: IC MULTIPLEXER 8X1 16TSSOP
标准包装: 2,500
功能: 多路复用器
电路: 1 x 8:1
导通状态电阻: 180 欧姆
电压电源: 单/双电源
电压 - 电源,单路/双路(±): 2 V ~ 12 V,±2 V ~ 6 V
电流 - 电源: 7µA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 16-TSSOP
包装: 带卷 (TR)
14
FN6416.3
April 13, 2009
ISL84581
Shrink Small Outline Plastic Packages (SSOP)
Quarter Size Outline Plastic Packages (QSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.10mm (0.004 inch) total in excess
of “B” dimension at maximum material condition.
10. Controlling dimension: INCHES. Converted millimeter dimen-
sions are not necessarily exact.
α
INDEX
AREA
E
D
N
12
3
-B-
0.17(0.007)
C A
M
B S
e
-A-
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
°
C
H
0.25(0.010)
B
M
L
0.25
0.010
GAUGE
PLANE
A2
M16.15A
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
(0.150” WIDE BODY)
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.061
0.068
1.55
1.73
-
A1
0.004
0.0098
0.102
0.249
-
A2
0.055
0.061
1.40
1.55
-
B
0.008
0.012
0.20
0.31
9
C
0.0075
0.0098
0.191
0.249
-
D
0.189
0.196
4.80
4.98
3
E
0.150
0.157
3.81
3.99
4
e
0.025 BSC
0.635 BSC
-
H
0.230
0.244
5.84
6.20
-
h
0.010
0.016
0.25
0.41
5
L
0.016
0.035
0.41
0.89
6
N16
16
7
α
-
Rev. 2 6/04
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