- 您现在的位置：买卖IC网 > PDF目录20586 > ISL89160FRTBZ (Intersil)IC MOSFET DRIVER 2CH 6A 8TDFN PDF资料下载
参数资料
| 型号： | ISL89160FRTBZ |
| 厂商： | Intersil |
| 文件页数： | 11/14页 |
| 文件大小： | 0K |
| 描述： | IC MOSFET DRIVER 2CH 6A 8TDFN |
| 标准包装： | 100 |
| 配置： | 低端 |
| 输入类型： | 非反相 |
| 延迟时间： | 25ns |
| 电流 - 峰： | 6A |
| 配置数： | 2 |
| 输出数： | 2 |
| 电源电压： | 4.5 V ~ 16 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-WDFN 裸露焊盘 |
| 供应商设备封装： | 8-TDFN-EP（3x3） |
| 包装： | 管件 |
ISL89160, ISL89161, ISL89162
General EPAD Heatsinking
Considerations
The thermal pad is electrically connected to the GND supply
through the IC substrate. The epad of the ISL89160, ISL89161,
ISL89162 has two main functions: to provide a quiet GND for the
input threshold comparators and to provide heat sinking for the
IC. The EPAD must be connected to a ground plane and no
switching currents from the driven FET should pass through the
ground plane under the IC.
Figure 18 is a PCB layout example of how to use vias to remove
EPAD GND
PLANE
COMPONENT LAYER
EPAD GND
PLANE
BOTTOM
LAYER
heat from the IC through the epad.
FIGURE 18. TYPICAL PCB PATTERN FOR THERMAL VIAS
For maximum heatsinking, it is recommended that a ground
plane, connected to the EPAD, be added to both sides of the PCB.
A via array, within the area of the EPAD, will conduct heat from
the EPAD to the GND plane on the bottom layer. The number of
vias and the size of the GND planes required for adequate
heatsinking is determined by the power dissipated by the
ISL89160, ISL89161, ISL89162, the air flow and the maximum
temperature of the air around the IC.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
11
FN7719.3
February 20, 2013
相关PDF资料 |
PDF描述 |
|---|---|
| A7PPB-2506M | CABLE D-SUB-AMM25B/AE25M/AMM25B |
| ISL89168FRTAZ-T | IC MOSFET DRIVER 2CH 6A 8TDFN |
| R1S-2424/H | CONV DC/DC 1W 24VIN 24VOUT |
| RACT20-350-US | POWER SUPPLIES |
| M7SSK-0906R | D-SUB CABLE MFM09K/MC10M/MFM09K |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL89160FRTBZ-T | 功能描述:IC MOSFET DRIVER 2CH 6A 8TDFN RoHS:是 类别:集成电路 (IC) >> PMIC - MOSFET，电桥驱动器 - 外部开关 系列:- 标准包装:6,000 系列:* |
| ISL89161FBEAZ | 功能描述:IC MOSFET DRIVER 2CH 6A 8SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - MOSFET，电桥驱动器 - 外部开关 系列:- 标准包装:50 系列:- 配置:高端 输入类型:非反相 延迟时间:200ns 电流 - 峰:250mA 配置数:1 输出数:1 高端电压 - 最大（自引导启动）:600V 电源电压:12 V ~ 20 V 工作温度:-40°C ~ 125°C 安装类型:通孔 封装/外壳:8-DIP（0.300"，7.62mm） 供应商设备封装:8-DIP 包装:管件 其它名称:*IR2127 |
| ISL89161FBEAZ-T | 功能描述:IC MOSFET DRIVER 2CH 6A 8SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - MOSFET，电桥驱动器 - 外部开关 系列:- 标准包装:6,000 系列:* |
| ISL89161FBEBZ | 功能描述:IC MOSFET DRIVER 2CH 6A 8SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - MOSFET，电桥驱动器 - 外部开关 系列:- 标准包装:50 系列:- 配置:高端 输入类型:非反相 延迟时间:200ns 电流 - 峰:250mA 配置数:1 输出数:1 高端电压 - 最大（自引导启动）:600V 电源电压:12 V ~ 20 V 工作温度:-40°C ~ 125°C 安装类型:通孔 封装/外壳:8-DIP（0.300"，7.62mm） 供应商设备封装:8-DIP 包装:管件 其它名称:*IR2127 |
| ISL89161FBEBZ-T | 功能描述:IC MOSFET DRIVER 2CH 6A 8SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - MOSFET，电桥驱动器 - 外部开关 系列:- 标准包装:6,000 系列:* |
发布紧急采购，3分钟左右您将得到回复。