参数资料
| 型号： | ISL90843UIU1027Z-TK |
| 厂商： | Intersil |
| 文件页数： | 2/10页 |
| 文件大小： | 0K |
| 描述： | IC XDCP 256-TAP 50OHM 10-MSOP |
| 标准包装： | 1,000 |
| 系列： | XDCP™ |
| 接片： | 256 |
| 电阻（欧姆）： | 50k |
| 电路数： | 4 |
| 存储器类型： | 易失 |
| 接口： | I²C（设备位址） |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 带卷 (TR) |
10
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8095.2
March 29, 2006
ISL90843
MSOP Packaging Information
10 Lead MSOP, Package Code
1 2 3 45
0.0197 [0.50] BSC
0.1970 [5.00]
(S)
0.1890 [4.80]
10 9 8 76
0.0374 [0.95]
0.0295 [0.75]
4
0.0059 [0.15]
(S)
0.0020 [0.05]
0.0433 [1.10] MAX.
0.0039 [0.10]
MAX. (S)
0.0106 [0.27]
0.0067 [0.17]
2
0.1220 [3.10]
0.1142 [2.90]
0.0098 [0.25]
A
0°-6°
3
0.1220 [3.10]
0.1142 [2.90]
SECTION A-A
GAUGE PLANE
0.1220 [3.10]
0.1142 [2.90]
BASE
4
0.0106 [0.27]
0.0067 [0.17]
WITH
PLATING
0.0050 [0.127]
0.0091 [0.23]
0.0051 [0.13]
WITH PLATING
0.0080 [0.203]
REF
METAL
NOTES:
1. Package dimensions conform to JEDEC specification MO-187BA.
2.
Does not include mold flash, protrusion
or gate burrs, mold flash protrusions
or gate burrs shall not exceed 0.15 mm per side.
3.
Does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 mm per side.
4.
Does not include dambar protrusion. Allowable dambar protrusion shall be 0.8 mm.
5. Lead span/stand-off height/coplanarity are considered as special characteristics.
6. Controlling dimensions in inches [mm].
2
3
4
3
0.0276 [0.70]
0.0157 [0.40]
相关PDF资料 |
PDF描述 |
|---|---|
| ISL95310WIU10Z | IC XDCP 128-TAP 10KOHM 10-MSOP |
| ISL95311WIU10Z | IC XDCP 128-TAP 10KOHM 10-MSOP |
| ISL95810WIU8-T | IC XDCP SGL 256-TAP 10KOHM 8MSOP |
| ISL95811WFRTZ | IC POT 256TAPS 5BYTES 8-TDFN |
| ISL96017UIRT8Z | IC POT DGTL 50K OHM 8-TDFN |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL90843WIU1027Z | 功能描述:IC XDCP 256-TAP 10OHM MSOP-10 RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:32 电阻（欧姆）:50k 电路数:1 温度系数:标准值 50 ppm/°C 存储器类型:易失 接口:3 线串行（芯片选择，递增，增/减） 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 细型，TSOT-23-6 供应商设备封装:TSOT-23-6 包装:带卷 (TR) |
| ISL90843WIU1027Z-TK | 功能描述:IC XDCP 256-TAP 10OHM 10-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:32 电阻（欧姆）:50k 电路数:1 温度系数:标准值 50 ppm/°C 存储器类型:易失 接口:3 线串行（芯片选择，递增，增/减） 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 细型，TSOT-23-6 供应商设备封装:TSOT-23-6 包装:带卷 (TR) |
| ISL9103 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:500mA 2.4MHz Low IQ High Efficiency Synchronous Buck Converter |
| ISL9103A | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:500mA 2.4MHz Low IQ High Efficiency Synchronous Buck Converter |
| ISL9103AIRUAZ-T | 功能描述:IC REG BUCK SYNC ADJ 0.5A 6UTDFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:50 系列:- 类型:升压（升压） 输出类型:可调式 输出数:1 输出电压:5 V ~ 25 V 输入电压:2.3 V ~ 5.5 V PWM 型:电流模式 频率 - 开关:600kHz，1.2MHz 电流 - 输出:1A 同步整流器:无 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 包装:管件 供应商设备封装:8-MSOP |
发布紧急采购，3分钟左右您将得到回复。