参数资料
型号: ISL95310UIU10Z
厂商: Intersil
文件页数: 8/8页
文件大小: 0K
描述: IC XDCP 128-TAP 50KOHM 10-MSOP
产品培训模块: Digitally Controlled Potentiometers
标准包装: 80
系列: XDCP™
接片: 128
电阻(欧姆): 50k
电路数: 1
温度系数: 标准值 ±45 ppm/°C
存储器类型: 非易失
接口: 3 线串行(芯片选择,递增,增/减)
电源电压: 2.7 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)
供应商设备封装: 10-MSOP
包装: 管件
8
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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FN8083.0
May 6, 2005
ISL95310
Packaging Information
10 Lead MSOP, Package Code
1
2
3
45
0.0197 [0.50] BSC
0.1970 [5.00]
(S)
0.1890 [4.80]
10
9
8
76
0.0374 [0.95]
0.0295 [0.75]
4
0.0059 [0.15]
(S)
0.0020 [0.05]
0.0433 [1.10] MAX.
0.0039 [0.10]
MAX.
(S)
0.0106 [0.27]
0.0067 [0.17]
2
0.1220 [3.10]
0.1142 [2.90]
0.0098 [0.25]
A
0°-6°
3
0.1220 [3.10]
0.1142 [2.90]
SECTION A-A
GAUGE PLANE
0.1220 [3.10]
0.1142 [2.90]
BASE
4
0.0106 [0.27]
0.0067 [0.17]
WITH
PLATING
0.0050 [0.127]
0.0091 [0.23]
0.0051 [0.13]
WITH PLATING
0.0080 [0.203]
REF
METAL
NOTES:
1. Package dimensions conform to JEDEC specification MO-187BA.
2.
Does not include mold flash, protrusion
or gate burrs, mold flash protrusions
or gate burrs shall not exceed 0.15 mm per side.
3.
Does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 mm per side.
4.
Does not include dambar protrusion. Allowable dambar protrusion shall be 0.8 mm.
5. Lead span/stand-off height/coplanarity are considered as special characteristics.
6. Controlling dimensions in inches [mm].
2
3
4
3
0.0276 [0.70]
0.0157 [0.40]
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ISL95310UIU10Z-TK 功能描述:IC XDCP 128-TAP 50KOHM 10-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 标准包装:3,000 系列:DPP 接片:32 电阻(欧姆):10k 电路数:1 温度系数:标准值 300 ppm/°C 存储器类型:非易失 接口:3 线串行(芯片选择,递增,增/减) 电源电压:2.5 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 供应商设备封装:8-TDFN(2x3) 包装:带卷 (TR)
ISL95310WIU10Z 功能描述:IC XDCP 128-TAP 10KOHM 10-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 标准包装:3,000 系列:DPP 接片:32 电阻(欧姆):10k 电路数:1 温度系数:标准值 300 ppm/°C 存储器类型:非易失 接口:3 线串行(芯片选择,递增,增/减) 电源电压:2.5 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 供应商设备封装:8-TDFN(2x3) 包装:带卷 (TR)
ISL95310WIU10Z-TK 功能描述:IC XDCP 128-TAP 10KOHM 10-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 标准包装:3,000 系列:DPP 接片:32 电阻(欧姆):10k 电路数:1 温度系数:标准值 300 ppm/°C 存储器类型:非易失 接口:3 线串行(芯片选择,递增,增/减) 电源电压:2.5 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 供应商设备封装:8-TDFN(2x3) 包装:带卷 (TR)
ISL95311UIU10Z 功能描述:IC XDCP 128-TAP 50KOHM 10-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:256 电阻(欧姆):100k 电路数:2 温度系数:标准值 35 ppm/°C 存储器类型:易失 接口:6 线串行(芯片选择,递增,增/减) 电源电压:2.6 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:14-TSSOP(0.173",4.40mm 宽) 供应商设备封装:14-TSSOP 包装:带卷 (TR)
ISL95311UIU10Z-TK 功能描述:IC XDCP 128-TAP 50KOHM 10-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:256 电阻(欧姆):100k 电路数:2 温度系数:标准值 35 ppm/°C 存储器类型:易失 接口:6 线串行(芯片选择,递增,增/减) 电源电压:2.6 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:14-TSSOP(0.173",4.40mm 宽) 供应商设备封装:14-TSSOP 包装:带卷 (TR)