参数资料
| 型号： | ISL95810UIU8Z |
| 厂商： | Intersil |
| 文件页数： | 5/13页 |
| 文件大小： | 0K |
| 描述： | IC XDCP SGL 256-TAP 50KOHM 8MSOP |
| 标准包装： | 80 |
| 系列： | XDCP™ |
| 接片： | 256 |
| 电阻（欧姆）： | 50k |
| 电路数： | 1 |
| 温度系数： | 标准值 ±45 ppm/°C |
| 存储器类型： | 非易失 |
| 接口： | I²C |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 管件 |
13
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FN8090.2
September 19, 2006
ISL95810
Thin Dual Flat No-Lead Plastic Package (TDFN)
//
NX (b)
SECTION "C-C"
5
(A1)
BOTTOM VIEW
A
6
AREA
INDEX
C
0.10
0.08
SIDE VIEW
0.15
2X
E
A
B
C
0.15
D
TOP VIEW
CB
2X
6
8
AREA
INDEX
NX L
E2
E2/2
REF.
e
N
(Nd-1)Xe
(DATUM A)
(DATUM B)
5
0.10
8
7
D2
B
A
M C
N-1
12
PLANE
SEATING
C
A
A3
NX b
D2/2
NX k
FOR EVEN TERMINAL/SIDE
TERMINAL TIP
CL
e
L
C
L8.3x3B
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.70
0.75
0.80
-
A1
-
0.05
-
A3
0.20 REF
-
b
0.23
0.30
0.38
5, 8
D
3.00 BSC
-
D2
2.15
2.30
2.40
7, 8
E
3.00 BSC
-
E2
1.35
1.50
1.60
7, 8
e
0.65 BSC
-
k0.20
-
L
0.20
0.30
0.40
8
N8
2
Nd
4
3
Rev. 0 6/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd refers to the number of terminals on D.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL95810UIU8Z-T | 功能描述:IC POT DGTL 50K OHM 8-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 接片:256 电阻（欧姆）:100k 电路数:1 温度系数:标准值 35 ppm/°C 存储器类型:非易失 接口:3 线串口 电源电压:2.7 V ~ 5.25 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WDFN 裸露焊盘 供应商设备封装:8-TDFN-EP（3x3） 包装:剪切带 (CT) 产品目录页面:1399 (CN2011-ZH PDF) 其它名称:MAX5423ETA+TCT |
| ISL95810WIRT8Z | 功能描述:IC XDCP 256-TAP 10KOHM 8-TDFN RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:256 电阻（欧姆）:100k 电路数:2 温度系数:标准值 35 ppm/°C 存储器类型:易失 接口:6 线串行（芯片选择，递增，增/减） 电源电压:2.6 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:14-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:14-TSSOP 包装:带卷 (TR) |
| ISL95810WIRT8ZR5481 | 制造商:Intersil Corporation 功能描述:ISL95810W PRE-PROGRAMMED TO LOWEST RESISTANCE SETTING, XDCP, - Rail/Tube 制造商:Intersil 功能描述:ISL95810W PRE-PROGRAMMED TO LOWEST RESISTANCE SETTING, XDCP, |
| ISL95810WIRT8Z-T | 功能描述:IC XDCP 256-TAP 10KOHM 8-TDFN RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 标准包装:3,000 系列:DPP 接片:32 电阻（欧姆）:10k 电路数:1 温度系数:标准值 300 ppm/°C 存储器类型:非易失 接口:3 线串行（芯片选择，递增，增/减） 电源电压:2.5 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 供应商设备封装:8-TDFN（2x3） 包装:带卷 (TR) |
| ISL95810WIRT8ZTR5481 | 制造商:Intersil Corporation 功能描述:ISL95810W PRE-PROGRAMMED TO LOWEST RESISTANCE SETTING, XDCP, - Tape and Reel |
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