参数资料
型号: ISL97691IRTZ
厂商: Intersil
文件页数: 5/19页
文件大小: 0K
描述: IC LED DRVR BACKLIGHT 3D 16TQFN
标准包装: 100
拓扑: PWM,升压(升压)
输出数: 4
内部驱动器:
类型 - 主要: 背光
频率: 400kHz ~ 1.5MHz
电源电压: 2.4 V ~ 5.5 V
输出电压: 26V
安装类型: 表面贴装
封装/外壳: 16-WFQFN 裸露焊盘
供应商设备封装: 16-TQFN(3x3)
包装: 管件
工作温度: -40°C ~ 85°C
ISL97691
Absolute Maximum Ratings
VIN, FSW, ISET, COMP, OVP . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
PWMI_1, PWMI_2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
1-WIRE_1, 1-WIRE_2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
CH1 to CH4, LX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 28V
PGND, AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V
Above voltage ratings are all with respect to AGND pin
ESD Ratings
Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . .2.5kV
Machine Model (Tested per JESD22-A115C) . . . . . . . . . . . . . . . . . . 200V
Charged Device Model (JESD22-C101E) . . . . . . . . . . . . . . . . . . . . . . . 2kV
Thermal Information
Thermal Resistance (Typical) θ JA (°C/W) θ JC (°C/W)
16 LD TQFN (Notes 6, 7) . . . . . . . . . . . . . . . 51 4.6
Thermal Characterization (Typical) PSI JT (°C/W)
16 Ld TQFN (Note 8 ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.11
Maximum Continuous Junction Temperature . . . . . . . . . . . . . . . . .+125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Latch Up (Tested per JESD-78B; Class 2, Level A) . . . . . . . . . . . . . . 100mA
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
6. θ JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379 .
7. For θ JC , the “case temp” location is the center of the exposed metal pad on the package underside.
8. PSI JT is the PSI junction-to-top thermal characterization parameter. If the package top temperature can be measured with this rating then the die
junction temperature can be estimated more accurately than the θ JC and θ JC thermal resistance ratings.
Electrical Specifications All specifications below are characterized at T A = -40°C to +85°C; V IN = 3.3V, PWMI_1 = 3.3V, R ISET = 26.7k ? ,
unless otherwise noted. Boldface limits apply over the operating temperature range, -40°C to +85°C.
MIN
MAX
PARAMETER
DESCRIPTION
CONDITION
(Note 9)
TYP
(Note 9)
UNIT
GENERAL
V IN
Backlight Supply Voltage
T A = +25°C
2.4
5.5
V
I VIN
V IN Active Current, All Strings 100% Duty, All channels 100% duty
I LED = 40mA
All channels 0% duty
2.5
0.8
mA
mA
I AUTOSHUTDOWN V IN Shutdown Current, both 1-Wire
Interface Inputs Inactive
PWMI_1 and PWMI_2 low longer
than t PWMTIMEOUT
1
μA
V OUT
Output Voltage
V IN ≥ 2.7V, I LED = 40mA
26
V
t WAKE
V UVLO
V UVLO_HYS
Wakeup Time from Sleep
Undervoltage Lockout Threshold
Undervoltage Lockout Hysteresis
Boost and channels operating
2
1.5
2.15
150
2.2
2.35
ms
V
mV
BOOST SWITCHING REGULATOR
SS
Soft-start
100% LED Duty Cycle
7
ms
SWILimit
r DS(ON)
Eff_peak
Boost FET Current Limit
Internal Boost Switch ON-Resistance
Peak Efficiency
T A = +25°C
V IN = 5.5V, V OUT = 21V, T A = +25°C,
R FSW = 144k ? , I CH1-CH4 = 20mA,
L = 10μH with DCR ≤ 150m ?
2.5
2.8
212
90
3.2
A
m ?
%
V IN = 2.4V, V OUT = 21V, T A = +25°C,
R FSW = 144k ? , I CH1-CH4 = 20mA,
L = 10μH with DCR ≤ 150m ?
74
%
D MAX
Boost Maximum Duty Cycle
FSW = 400kHz
FSW = 1.5MHz
93.5
93
%
%
5
FN7840.1
February 1, 2013
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