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参数资料
| 型号： | IT1-168P/28-19H |
| 厂商： | Hirose Electric Co Ltd |
| 文件页数： | 10/17页 |
| 文件大小： | 0K |
| 描述： | CONN HEADER 168POS STR 19MM GOLD |
| 标准包装： | 52 |
| 系列： | IT1 |
| 连接器类型： | 模块，中央触点带 |
| 位置数： | 168 |
| 间距： | 0.020"（0.50mm） |
| 行数： | 2 |
| 特点： | 双面 |
| 触点表面涂层： | 金 |
| 包装： | 托盘 |
| 配套产品： | IT1A-168S-SV-ND - CONN RCPT 168POS HISPEED STR SMD IT1-168S-SV-ND - CONN RCPT 168POS HISPEED STR SMD |
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
IT1 Series q High Speed, Matched-Impedance, Parallel Board-to-board Connector System
2. Recommended Design Guidelines
2-1 Solder Land Pattern
When placing the receptacles on the Printed Circuit Boards using automatic mounting equipment or manually, assure that the
correct diameters of the holes (Fig. 1) are through the entire thickness of the board.
S Locating post hole diameter S
The contacts of receptacle assembly are exposed on the bottom surfaces. The exposed areas of the contacts are a distance
of 0.25 mm minimum from the surface of the Printed Circuit Board, on which the receptacle assembly is placed (Fig.2).
Consideration should be taken not to place or assure insulation of conductive traces under the receptacle assemblies.
Refer to the separate drawings for recommended solder land pattern dimensions of the receptacle, and signals and ground
connection diagram of the transmission module.
(mm)
Automatic placement / (Locating post hole diameter) C dimension: 1.7 mm
Manual placement
/ (Locating post hole diameter) C dimension: 1.6 mm
/ A position accuracy of +- 0.03 should be exercised from the
center of the hole to contact Number 84.
Fig. 1 IT1-168S-SV Recommended Solder Land Pattern
Contact_A
Contact_B
Fig. 2 Cross section of IT1 receptacle
2-2 Board-to-Board Spacer heights
The two parallel boards connected by the IT1 connectors should be fastened to additional spacers between them.
Fig. 3 indicates the connector height tolerance and the spacer’s height.
When designing the spacer’s height, consideration should be given to the solder paste thickness and any other features,
which may affect the full mating of the connector.
Fig. 3 indicates design dimensions for the 19 mm board-to-board distance.
(mm)
Fig. 3
A303
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IT1-168P-SV | 制造商:HRS 制造商全称:HRS 功能描述:High Speed, Matched-Impedance, Parallel Board-to-board Connector |
| IT1-168S-SV | 功能描述:板对板与夹层连接器 RCP 168 POS 0.5mm Solder ST SMD Tray RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
| IT1-168S-SV(03) | 功能描述:板对板与夹层连接器 168P STR RCP SCK SMT LOC BOS HEAT RES TPE RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
| IT1-168S-SV(13) | 功能描述:板对板与夹层连接器 168P STR RCP SCK SMT LOC BOS HEAT RES TPE RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
| IT1-168S-SV(25) | 功能描述:板对板与夹层连接器 168P STR RCP SCK SMT LOC BOS HEAT RES TPE RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
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