- 您现在的位置：买卖IC网 > PDF目录6519 > IT1-252P/44-23H (Hirose Electric Co Ltd)CONN HEADER 252POS STR 23MM GOLD PDF资料下载
参数资料
| 型号： | IT1-252P/44-23H |
| 厂商： | Hirose Electric Co Ltd |
| 文件页数： | 1/17页 |
| 文件大小： | 0K |
| 描述： | CONN HEADER 252POS STR 23MM GOLD |
| 标准包装： | 28 |
| 系列： | IT1 |
| 连接器类型： | 模块，中央触点带 |
| 位置数： | 252 |
| 间距： | 0.020"（0.50mm） |
| 行数： | 2 |
| 特点： | 双面 |
| 触点表面涂层： | 金 |
| 包装： | 托盘 |
| 配套产品： | IT1-252S-SV-ND - CONN RCPT 252POS HISPEED STR SMD |
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
High Speed, Matched-Impedance, Parallel Board-to-board Connector
IT1 Series
Receptacle (2 required)
IT1 Series Outline
High-speed matched-impedance parallel board-to-board
connector designed for applications requiring board-to-
board spacing with transmission speeds exceeding
1GHz. The connection system has matched impedance
of 50 ohm or can be customized. Contacts are on 0.5mm
pitch.
s Features
1. Impedance Matching using a 4-Layer Board
The innovative transmission module uses PC boards
with a strip line design of transmission lines, providing
matched impedance of 50 ohms, for standard product.
2. Supports Multiple Connectors per board
Designed with a tolerance of +/- 0.2mm for both the X
and Y-axis. The three-piece structure and the +/- 0.2mm
tolerance allows 3 or more IT1’s to be mounted on a
single board.
3. Customized Board-to-Board Distance
Board-to-board distance can be customized, from 16mm
to 40mm.
Ground lines or additional traces can be added to
support high level, high speed transmission or mixed
power/signal applications.
4. Signal to Ground Ratio
The standard signal-to-ground ratio is 10:2, which makes
reliable matching of the characteristic impedance of each
transmission line. This ratio also can be customized.
5. Contact Reliability
Use of double contact points on each of the contacts
assures highly reliable performance.
Transmission Module
q Connection Cross-Sectional Diagram
Receptacle
2-Point contact
4-Layer board
(Impedance matching)
Transmission Module
2-Point contact
Receptacle
s Applications
Routers, servers, base stations and other
telecommunication equipment.
A294
相关PDF资料 |
PDF描述 |
|---|---|
| ALQ318 | RELAY GEN PURPOSE SPST 10A 18V |
| 74388-001LF | MEG-ARRAY 400POS RCPT 4MM W/CAP |
| 125800D00000G | SOLDER ANCHOR FOR BGA HEATSINKS |
| 74388-001 | MEG-ARR 400POS RECP 6MM 15AU CAP |
| 77083510P | RES ARRAY 51 OHM 4 RES 8-SIP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IT1-252P-SV | 制造商:HRS 制造商全称:HRS 功能描述:High Speed, Matched-Impedance, Parallel Board-to-board Connector |
| IT1-252S-SV | 功能描述:板对板与夹层连接器 RCP 252 POS 0.5mm Solder ST SMD Tray RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
| IT1-252S-SV(03) | 功能描述:板对板与夹层连接器 252P STR RCP SCK SMT LOCATE BOSS RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
| IT1-252S-SV(25) | 功能描述:板对板与夹层连接器 252P STR RCP SCK SMT LOC BOS HEAT RES TPE RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
| IT1-252S-SV(26) | 功能描述:板对板与夹层连接器 252P STR RCP SCK SMT LOC BOS HEAT RES TPE RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
发布紧急采购，3分钟左右您将得到回复。