First Release
Copyright IXYS CORPORATION 2002
Features
Built using the advantages and compatibility
of CMOS and IXYS HDMOS
TM
processes
Latch-Up Protected Over Entire
Operating Range
High Peak Output Current: 2A Peak
Wide Operating Range: 4.5V to 25V
High Capacitive Load
Drive Capability: 1000pF in <10ns
Matched Rise And Fall Times
Low Propagation Delay Time
Low Output Impedance
Low Supply Current
Two Drivers in Single Chip
Applications
Driving MOSFETs and IGBTs
Motor Controls
Line Drivers
Pulse Generators
Local Power ON/OFF Switch
Switch Mode Power Supplies (SMPS)
DC to DC Converters
Pulse Transformer Driver
Class D Switching Amplifiers
General Description
The IXDN402/IXDI402/IXDF402 consists of two 2 Amp
CMOS high speed MOSFET drivers. Each output can
source and sink 2A of peak current while producing voltage
rise and fall times of less than 15ns to drive the latest IXYS
MOSFETs & IGBTs. The input of the driver is TTL or CMOS
compatible and is fully immune to latch up over the entire
operating range. A patent-pending circuit virtually eliminates
cross conduction and current shoot-through. Improved
speed and drive capabilities are further enhanced by very
low and matched rise and fall times.
The IXDN402 is configured as a dual non-inverting gate
driver, the IXDI402 as a dual inverting gate driver, and the
IXDF402 as a dual inverting + non-inverting gate driver.
The IXDN402/IXDI402/IXDF402 family are available in the
standard 8 pin P-DIP (PI), SOP-8 (SIA) and SOP-16 (SIA-
16) packages. For enhanced thermal performance, the
SOP-8 and SOP-16 are also available with an exposed
grounded backmetal package as the SI and SI-16 respec-
tively.
IXDN402 / IXDI402 / IXDF402
2 Ampere Dual Low-Side Ultrafast MOSFET Drivers
Ordering Information
NOTE:
Mounting or solder tabs on all packages are connected to ground
Part Number
IXDN402PI
IXDN402SI
IXDN402SIA
IXDN402SI-16
IXDN402SIA-16
IXDI402PI
IXDI402SI
IXDI402SIA
IXDI402SI-16
IXDI402SIA-16
IXDF402PI
IXDF402SI
IXDF402SIA
IXDF402SI-16
IXDF402SIA-16
Package Type
8-Pin PDIP
8-Pin SOIC with Grounded Backmetal
8-Pin SOIC
16-Pin SOIC with Grounded Backmetal
16-Pin SOIC
8-Pin PDIP
8-Pin SOIC with Grounded Backmetal
8-Pin SOIC
16-Pin SOIC with Grounded Backmetal
16-Pin SOIC
8-Pin PDIP
8-Pin SOIC with Grounded Backmetal
8-Pin SOIC
16-Pin SOIC with Grounded Backmetal
16-Pin SOIC
Temp. Range
Configuration
-55
°
C to
+125
°
C
Dual Non
Inverting
-55
°
C to
+125
°
C
Dual Inverting
-55
°
C to
+125
°
C
Inverting + Non
Inverting