参数资料
型号: IXFX34N80
厂商: IXYS
文件页数: 1/2页
文件大小: 0K
描述: MOSFET N-CH 800V 34A PLUS247
标准包装: 30
系列: HiPerFET™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 800V
电流 - 连续漏极(Id) @ 25° C: 34A
开态Rds(最大)@ Id, Vgs @ 25° C: 240 毫欧 @ 17A,10V
Id 时的 Vgs(th)(最大): 5V @ 8mA
闸电荷(Qg) @ Vgs: 270nC @ 10V
输入电容 (Ciss) @ Vds: 7500pF @ 25V
功率 - 最大: 560W
安装类型: 通孔
封装/外壳: TO-247-3
供应商设备封装: PLUS247?-3
包装: 管件
HiPerFET TM
Power MOSFETs
Single MOSFET Die
IXFK 34N80
IXFX 34N80
V DSS
I D25
R DS(on)
= 800 V
= 34 A
= 0.24 W
Avalanche Rated
Preliminary data sheet
t rr £ 250 ns
Symbol
Test Conditions
Maximum Ratings
PLUS 247 TM (IXFX)
V DSS
V DGR
T J = 25 ° C to 150 ° C
T J = 25 ° C to 150 ° C; R GS = 1 M W
800
800
V
V
V GS
V GSM
Continuous
Transient
± 20
± 30
V
V
G
D
(TAB)
I D25
I DM
I AR
T C = 25 ° C
T C = 25 ° C, pulse width limited by T JM
T C = 25 ° C
34
136
36
A
A
A
TO-264 AA (IXFK)
E AR
E AS
dv/dt
T C = 25 ° C
T C = 25 ° C
I S £ I DM , di/dt £ 100 A/ m s, V DD £ V DSS
T J £ 150 ° C, R G = 2 W
64
3
5
mJ
J
V/ns
G = Gate
G
D
S
D = Drain
(TAB)
P D
T C = 25 ° C
560
W
S = Source
TAB = Drain
T J
-55 ... +150
° C
T JM
T stg
T L
1.6 mm (0.063 in.) from case for 10 s
150
-55 ... +150
300
° C
° C
° C
Features
? International standard packages
M d
Mounting torque
TO-264
0.9/6 Nm/lb.in.
? Low R DS (on) HDMOS TM process
? Rugged polysilicon gate cell structure
Weight
PLUS 247
TO-264
6
10
g
g
? Unclamped Inductive Switching (UIS)
rated
? Low package inductance
- easy to drive and to protect
? Fast intrinsic rectifier
Applications
Symbol
Test Conditions
Characteristic Values
(T J = 25 ° C, unless otherwise specified)
min. typ. max.
? DC-DC converters
? Battery chargers
? Switched-mode and resonant-mode
power supplies
V DSS
V GS(th)
I GSS
I DSS
R DS(on)
V GS = 0 V, I D = 3mA
V DS = V GS , I D = 8mA
V GS = ± 20 V, V DS = 0
V DS = V DSS
V GS = 0 V
V GS = 10 V, I D = 0.5 ? I D25
Note 1
T J = 25 ° C
T J = 125 ° C
800
3.0
V
5.0 V
± 200 nA
100 m A
2 mA
0.24 W
? DC choppers
? AC motor control
? Temperature and lighting controls
Advantages
? PLUS 247 TM package for clip or spring
mounting
? Space savings
? High power density
IXYS reserves the right to change limits, test conditions, and dimensions.
? 2000 IXYS All rights reserved
98560B (6/99)
1-2
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