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参数资料
| 型号： | K2502GRP |
| 厂商： | Littelfuse Inc |
| 文件页数： | 6/12页 |
| 文件大小： | 0K |
| 描述： | SIDAC 250V DO15 |
| 标准包装： | 5,000 |
| 电流 - 峰值输出： | 1A |
| 电压 - 击穿： | 240 ~ 280V |
| 电流 - 维持(Ih)： | 150mA |
| 电流 - 击穿： | 10µA |
| 封装/外壳： | DO-204AC，DO-15，轴向 |
| 供应商设备封装： | DO-15 |
| 包装： | 带卷 (TR) |
Teccor ? brand Thyristors
Standard Bidirectional SIDACs
Soldering Parameters
Re?ow Condition
- Temperature Min (T s(min) )
150°C
T P
Ramp-up
t P
- Temperature Max (T s(max) )
Pre Heat
- Time (min to max) (t s )
Average ramp up rate (Liquidus Temp)
(T L ) to peak
T S(max) to T L - Ramp-up Rate
200°C
60 – 180 secs
5°C/second max
5°C/second max
T L
T S(max)
T S(min)
t S
Preheat
t L
Ramp-down
Re?ow
- Temperature (T L ) (Liquidus)
- Temperature (t L )
60 – 150 seconds
25
time to peak temperature
Time
Peak Temperature (T P )
Time within 5 °C of actual peak
Temperature (t p )
Ramp-down Rate
Time 2 5 °C to peak Temperature (T P )
Do not exceed
Physical Speci?cations
260 +0/-5 °C
20 – 40 seconds
5°C/second max
280°C
Reliability/Environmental Tests
Test
Speci?cations and Conditions
Terminal Finish
Dipped
High Temperature
Body Material
Lead Material
Voltage Blocking
Temperature Cycling
Biased Temperature &
hours
-40°C to 150°C, 15-minute dwell, 100
EIA/JEDEC: JESD22-A101
Design Considerations
Humidity
hours
DC
Careful selection of the correct device for the application’s
operating parameters and environment will go a long
SIDACs. Correct mounting, soldering, and forming of the
leads also help protect against component damage.
Kxxxzy Series
318
High Temp Storage
Low-Temp Storage
Thermal Shock
Autoclave
(Pressure Cooker Test)
Resistance to
Solder Heat
Solderability
Lead Bend
150°C, 1008 hours
-40°C, 1008 hours
0°C to 100°C, 5-minute dwell,
EIA/JEDEC: JESD22-A102
260°C, 10 seconds
?2010 Littelfuse, Inc
Revised: March 31, 2010 03:44 PM
Speci?cations are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
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