参数资料
型号: KIT3376MMA7331LC
厂商: Freescale Semiconductor
文件页数: 8/11页
文件大小: 0K
描述: KIT EVAL 3AXIS ANLG ACCELEROMETR
标准包装: 1
系列: *
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
PCB Mounting Recommendations
MEMS based sensors are sensitive to Printed Circuit
Board (PCB) reflow processes. For optimal zero-g offset after
PCB mounting, care must be taken to PCB layout and reflow
conditions. Reference application note AN3484 for best
practices to minimize the zero-g offset shift after PCB
mounting.
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
With the correct footprint, the packages will self-align when
subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
10x0.8
1
13
6x2
6
8
14x0.6
12x1
14x0.9
Figure 8. LGA 14-Lead, 5 x 3 mm Die Sensor
MMA7331LC
Sensors
8
Freescale Semiconductor
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