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参数资料
| 型号： | KIT34674EPEVBE |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 5/26页 |
| 文件大小： | 0K |
| 描述： | KIT EVAL BOARD 10CH LED BACKLGHT |
| 标准包装： | 1 |
| 系列： | * |
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Input voltage range
V
VIN Pin
GRN and RED Pins
EN, BAT, REF and TEMP Pins
ESD Voltage (2)
Human Body Model (HBM)
Machine Model (MM)
THERMAL RATINGS
Operating Temperature
Ambient
Junction
V IN
V GRN , V RED
V EN , V BAT ,
V REF , V TEMP
V ESD
T A
T J
-0.3 to 28
-0.3 to 12
-0.3 to 5.5
± 2000
± 200
-40 to 85
-40 to 150
V
°C
Storage Temperature
Resistance (3)
Thermal
Junction-to-Case
Junction-to-Ambient
T STG
R θ JC
R θ JA
-65 to 150
10
70
°C
°C/W
Peak Package Reflow Temperature During
T PPRT
°C
Notes
2. ESD testing is performed in accordance with the Human Body Model (HBM) (C ZAP = 100 pF, R ZAP = 1500 Ω ), and the Machine Model
(MM) (C ZAP = 200 pF, R ZAP = 0 Ω ).
3.
4.
5.
Device mounted on the Freescale EVB test board per JEDEC DESD51-2.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
34674
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
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