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参数资料
| 型号： | KITMPL115A2I2C |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 10/16页 |
| 文件大小： | 0K |
| 描述： | KIT EVALUATION FOR PL115A2I2C |
| 标准包装： | 1 |
| 传感器类型： | 压力 |
| 传感范围： | 50 ~ 115 kPa |
| 接口： | I²C |
| 电源电压： | 2.375 V ~ 5.5 V |
| 嵌入式： | 否 |
| 已供物品： | 板 |
| 已用 IC / 零件： | PL115A2I2C |
| 产品目录页面： | 2808 (CN2011-ZH PDF) |
3.5
Example of Pressure Compensated Calculation in Floating-point Notation
a0 coefficient
b1 coefficient
b2 coefficient
=
=
=
2009.75
-2.37585
-0.92047
c12 coefficient =
0.000790
Pressure
Temperature
=
=
410 ADC counts
507 ADC counts
Pressure Compensation:
Pcomp = a0 + ( b1 + c12 ? Tadc ) ? Padc + b ( c )
Using the evaluation sequence shown in Section 3.3:
c12x2
= c12 * Tadc
= 0.000790 * 507
= 0.40053
a1
= b1 + c12x2 = -2.37585 + 0.40053
= -1.97532
a1x1
y1
a2x2
= a1 * Padc
= a0 + a1x1
= b2 * Tadc
= -1.97532 * 410
= 2009.75 + (-809.8812)
= -0.92047 * 507
= -809.8812
= 1199.8688
= -466.67829
PComp = y1 + a2x2
= 1199.8688 + (-466.67829)
= 733.19051
---------------------- + 50
Pressure (kPa) = P comp
?
115 – 50
1023
= 96.59kPa
---------------------- + 50
= 733.19
?
115 – 50
1023
4
1.
2.
Solder Recommendations
Use SAC solder alloy (i.e., Sn-Ag-Cu) with a melting point of about 217°C. It is recommended to use SAC305
(i.e., Sn-3.0 wt.% Ag-0.5 wt.% Cu).
Reflow
?
?
?
?
?
?
Ramp up rate: 2 to 3°C/s.
Preheat flat (soak): 110 to 130s.
Reflow peak temperature: 250 ° C to 260°C (depends on exact SAC alloy composition).
Time above 217°C: 40 to 90s (depends on board type, thermal mass of the board/quantities in the reflow).
Ramp down: 5 to 6°C/s.
Using an inert reflow environment (with O 2 level about 5 to 15 ppm).
MPL115A2
Sensors
10
Freescale Semiconductor, Inc.
相关PDF资料 |
PDF描述 |
|---|---|
| KITMPVZ5004EVK | KIT EVAL PRESSURE SENS BOARD |
| KN500B1/4 | SWITCH KNOB STRAIGHT .50" BLACK |
| KN5700B1/4 | SWITCH KNOB STRAIGHT .75" BLACK |
| KN700B1/4 | SWITCH KNOB STRAIGHT .75" BLACK |
| KS-100 | PROTECTIVE COVER FOR RELAYS |
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