参数资料
型号: KMPC8313VRAFFB
厂商: Freescale Semiconductor
文件页数: 90/99页
文件大小: 0K
描述: IC MPU POWERQUICC II 516-PBGA
标准包装: 2
系列: MPC83xx
处理器类型: 32-位 MPC83xx PowerQUICC II Pro
速度: 333MHz
电压: 0.95 V ~ 1.05 V
安装类型: 表面贴装
封装/外壳: 516-BBGA 裸露焊盘
供应商设备封装: 516-PBGAPGE(27x27)
包装: 托盘
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
90
Freescale Semiconductor
Third, between the device and any SerDes voltage regulator there should be a 10-F, low
equivalent series resistance (ESR) SMT tantalum chip capacitor and a 100-F, low ESR SMT
tantalum chip capacitor. This should be done for all SerDes supplies.
22.5
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to NVDD, GVDD, LVDD, LVDDA, or LVDDB as required.
Unused active high inputs should be connected to VSS. All NC (no-connect) signals must remain
unconnected.
Power and ground connections must be made to all external VDD, NVDD, GVDD, LVDD, LVDDA, LVDDB,
and VSS pins of the device.
22.6
Output Buffer DC Impedance
The MPC8313E drivers are characterized over process, voltage, and temperature. For all buses, the driver
is a push-pull single-ended driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to NVDD
or VSS. Then, the value of each resistor is varied until the pad voltage is NVDD/2 (see Figure 60). The
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open), and RP is trimmed until the voltage at the pad equals
NVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 = (RP + RN)/2.
Figure 60. Driver Impedance Measurement
The value of this resistance and the strength of the driver’s current source can be found by making two
measurements. First, the output voltage is measured while driving logic 1 without an external differential
termination resistor. The measured voltage is V1 = Rsource Isource. Second, the output voltage is measured
while driving logic 1 with an external precision differential termination resistor of value Rterm. The
measured voltage is V2 =(1/(1/R1 +1/R2)) Isource. Solving for the output impedance gives Rsource =
Rterm (V1/V2 – 1). The drive current is then Isource =V1/Rsource.
NVDD
VSS
Pad
Data
SW1
SW2
RN
RP
相关PDF资料
PDF描述
IDT70T653MS12BCI8 IC SRAM 18MBIT 12NS 256BGA
IDT70V5378S200BC IC SRAM 576KBIT 200MHZ 256BGA
IDT70T653MS15BC IC SRAM 18MBIT 15NS 256BGA
305-012-521-204 CONN CARDEDGE 12POS .156 GREEN
346-012-541-804 CARDEDGE 12POS DUAL .125 GREEN
相关代理商/技术参数
参数描述
KMPC8313VRAGDB 功能描述:微处理器 - MPU 8313 PowerQUICC W/O ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8313ZQADDB 功能描述:微处理器 - MPU 8313 REV2.1 W/O ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8313ZQAFFB 功能描述:微处理器 - MPU 8313 REV2.1 W/O ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8314CVRAGDA 功能描述:微处理器 - MPU NON-ENCRYPT RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8314ECVRAGDA 功能描述:微处理器 - MPU ENCRYPT RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324