参数资料
型号: KMPC8343ZQAGD
厂商: Freescale Semiconductor
文件页数: 33/80页
文件大小: 0K
描述: IC MPU PWRQUICC II 620-PBGA
标准包装: 2
系列: MPC83xx
处理器类型: 32-位 MPC83xx PowerQUICC II Pro
速度: 400MHz
电压: 1.2V
安装类型: 表面贴装
封装/外壳: 620-BBGA 裸露焊盘
供应商设备封装: 620-PBGA(29x29)
包装: 托盘
MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Freescale Semiconductor
39
JTAG
Figure 23 provides the AC test load for TDO and the boundary-scan outputs of the MPC8343EA.
Figure 23. AC Test Load for the JTAG Interface
Figure 24 provides the JTAG clock input timing diagram.
Figure 24. JTAG Clock Input Timing Diagram
Figure 25 provides the TRST timing diagram.
Figure 25. TRST Timing Diagram
JTAG external clock to output high impedance:
Boundary-scan data
TDO
tJTKLDZ
tJTKLOZ
2
19
9
ns
5, 6
Notes:
1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question.
The output timings are measured at the pins. All output timings assume a purely resistive 50
Ω load (see Figure 14).
Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
2. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG device timing
(JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference (K) going
to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input signals (D)
went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. In general, the clock reference symbol is
based on three letters representing the clock of a particular function. For rise and fall times, the latter convention is used with
the appropriate letter: R (rise) or F (fall).
3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.
4. Non-JTAG signal input timing with respect to tTCLK.
5. Non-JTAG signal output timing with respect to tTCLK.
6. Guaranteed by design and characterization.
Table 37. JTAG AC Timing Specifications (Independent of CLKIN)1 (continued)
At recommended operating conditions (see Table 2).
Parameter
Symbol2
Min
Max
Unit
Notes
Output
Z0 = 50 Ω
OVDD/2
RL = 50 Ω
JTAG
tJTKHKL
tJTGR
External Clock
VM
tJTG
tJTGF
VM = Midpoint Voltage (OVDD/2)
TRST
VM = Midpoint Voltage (OVDD/2)
VM
tTRST
相关PDF资料
PDF描述
XC4036XL-2HQ208I IC FPGA I-TEMP 3.3V 2SPD 208HQFP
XC4036XL-1HQ208C IC FPGA C-TEMP 3.3V 1SPD 208HQFP
65801-118LF CLINCHER RECEPTACLE ASSY TIN
IDT70V9279S6PRF IC SRAM 512KBIT 6NS 128TQFP
KMPC8275VRMIBA IC MPU PWRQUICC II HIP7 516-PBGA
相关代理商/技术参数
参数描述
KMPC8343ZQAGDB 功能描述:微处理器 - MPU 8347 PBGA PB W/O ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8347CVRAGDB 功能描述:微处理器 - MPU 8347 PBGA NOPB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8347CVVAJDB 功能描述:微处理器 - MPU 8349 TBGA NOPB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8347CZQAGDB 功能描述:微处理器 - MPU 8347 PBGA W/PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8347CZUAJDB 功能描述:微处理器 - MPU 8349 TBGA W/O ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324