参数资料
型号: KMPC8541EPXALF
厂商: Freescale Semiconductor
文件页数: 78/88页
文件大小: 0K
描述: IC MPU POWERQUICC III 783-FCPBGA
标准包装: 1
系列: MPC85xx
处理器类型: 32-位 MPC85xx PowerQUICC III
速度: 667MHz
电压: 1.2V
安装类型: 表面贴装
封装/外壳: 783-BBGA,FCBGA
供应商设备封装: 783-FCPBGA(29x29)
包装: 托盘
MPC8541E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 4.2
8
Freescale Semiconductor
Electrical Characteristics
2.1.1
Absolute Maximum Ratings
Table 1 provides the absolute maximum ratings.
2.1.2
Power Sequencing
The MPC8541Erequires its power rails to be applied in a specific sequence in order to ensure proper device
operation. These requirements are as follows for power up:
1. VDD, AVDDn
2. GVDD, LVDD, OVDD (I/O supplies)
Table 1. Absolute Maximum Ratings 1
Characteristic
Symbol
Max Value
Unit
Notes
Core supply voltage
VDD
–0.3 to 1.32
0.3 to 1.43 (for 1 GHz only)
V
PLL supply voltage
AVDD
–0.3 to 1.32
0.3 to 1.43 (for 1 GHz only)
V
DDR DRAM I/O voltage
GVDD
–0.3 to 3.63
V
Three-speed Ethernet I/O, MII management voltage
LVDD
–0.3 to 3.63
–0.3 to 2.75
V
CPM, PCI, local bus, DUART, system control and power
management, I2C, and JTAG I/O voltage
OVDD
–0.3 to 3.63
V
3
Input voltage
DDR DRAM signals
MVIN
–0.3 to (GVDD + 0.3)
V
2, 5
DDR DRAM reference
MVREF
–0.3 to (GVDD + 0.3)
V
2, 5
Three-speed Ethernet signals
LVIN
–0.3 to (LVDD + 0.3)
V
4, 5
CPM, Local bus, DUART,
SYSCLK, system control and
power management, I2C, and
JTAG signals
OVIN
–0.3 to (OVDD + 0.3)1
V
5
PCI
OVIN
–0.3 to (OVDD + 0.3)
V
6
Storage temperature range
TSTG
–55 to 150
°C
Notes:
1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and
functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
2. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
3. Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
4. Caution: LVIN must not exceed LVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
5. (M,L,O)VIN and MVREF may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.
6. OVIN on the PCI interface may overshoot/undershoot according to the PCI Electrical Specification for 3.3-V operation, as
shown in Figure 3.
相关PDF资料
PDF描述
IDT709289L7PF IC SRAM 1MBIT 7NS 100TQFP
KMPC8540VTAQFB IC MPU PWRQUICC 783-FCPBGA
KMPC8540VT833LB IC MPU PWRQUICC 783-FCPBGA
IDT709099L7PF IC SRAM 1MBIT 7NS 100TQFP
KMPC8540VT667LC IC MPU PWRQUICC 783-FCPBGA
相关代理商/技术参数
参数描述
KMPC8541EPXAPF 功能描述:微处理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8541EPXAQF 功能描述:微处理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8541EVTALF 功能描述:微处理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8541EVTAPF 功能描述:微处理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8541EVTAQF 功能描述:微处理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324