参数资料
型号: KMPC8545EHXANG
厂商: Freescale Semiconductor
文件页数: 55/151页
文件大小: 0K
描述: IC MPU PWRQUICC III 783-FCCBGA
标准包装: 2
系列: MPC85xx
处理器类型: 32-位 MPC85xx PowerQUICC III
速度: 80GHz
电压: 1.1V
安装类型: 表面贴装
封装/外壳: 783-BBGA,FCBGA
供应商设备封装: 783-FCPBGA(29x29)
包装: 托盘
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
148
Freescale Semiconductor
Document Revision History
24 Document Revision History
The following table provides a revision history for this hardware specification.
Table 88. Document Revision History
Rev.
Number
Date
Substantive Change(s)
9
02/2012
Version 3.1.x Silicon with Stamped Lid,” with version 3.0 silicon information.
Updated Table 87, “Part Numbering Nomenclature,” with version 3.0 silicon information.
Removed table 11.
Corrected the leaded Solder Ball composition in Table 70, “Package Parameters
Updated Table 87, “Part Numbering Nomenclature,” with Version 3.1.x silicon information.
Updated the Min and Max value of TDO in the valid times row of Table 44, “JTAG AC Timing
Specifications (Independent of SYSCLK)1” from 4 and 25 to 2 and 10 respectively .
8
04/2011
Updated Table 71, “MPC8548E Pinout Listing,” Table 72, “MPC8547E Pinout Listing,” Table 73,
“MPC8545E Pinout Listing,” and Table 74, “MPC8543E Pinout Listing,” to reflect that the TDO signal
is not driven during HRSET* assertion.
Updated Table 87, “Part Numbering Nomenclature” with Ver. 2.1.3 silicon information.
7
09/2010
In Table 37, “MII Management AC Timing Specifications, modified the fifth row from “MDC to MDIO
delay tMDKHDX (16 × tptb_clk × 8) – 3 — (16 × tptb_clk × 8) + 3” to “MDC to MDIO delay tMDKHDX
(16 × tCCB × 8) – 3 — (16 × tCCB × 8) + 3.”
6
12/2009
In Section 5.1, “Power-On Ramp Rate” added explanation that Power-On Ramp Rate is required to
avoid falsely triggering ESD circuitry.
In Table 13 changed required ramp rate from 545 V/s for MVREF and VDD/XVDD/SVDD to 3500 V/s
for MVREF and 4000 V/s for VDD.
In Table 13 deleted ramp rate requirement for XVDD/SVDD.
In Table 13 footnote 1 changed voltage range of concern from 0–400 mV to 20–500mV.
In Table 13 added footnote 2 explaining that VDD voltage ramp rate is intended to control ramp rate of
AVDD pins.
5
10/2009
In Table 27, “GMII Receive AC Timing Specifications,” changed duty cycle specification from 40/60 to
35/75 for RX_CLK duty cycle.
Added a reference to Revision 2.1.2.
Added Section 5.1, “Power-On Ramp Rate.”
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KMPC8545EHXAQG IC MPU PWRQUICC III 783-FCCBGA
相关代理商/技术参数
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KMPC8545EHXAQG 功能描述:微处理器 - MPU PQ38 8548E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8545EHXATG 功能描述:微处理器 - MPU PQ38 8548E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8545EVUANG 功能描述:微处理器 - MPU PQ38 8548E PB-FREE RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8545EVUANJ 功能描述:微处理器 - MPU PQ38 8548E PB-FREE RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
KMPC8545EVUAQG 功能描述:微处理器 - MPU PQ38 8548E PB-FREE RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324