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| 型号： | KMPC859TZP133A |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 4/96页 |
| 文件大小： | 0K |
| 描述： | IC MPU POWERQUICC 133MHZ 357PBGA |
| 标准包装： | 2 |
| 系列： | MPC8xx |
| 处理器类型： | 32-位 MPC8xx PowerQUICC |
| 速度： | 133MHz |
| 电压： | 1.8V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 357-BBGA |
| 供应商设备封装： | 357-PBGA（25x25） |
| 包装： | 托盘 |
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MPC866/MPC859 Hardware Specifications, Rev. 2
12
Freescale Semiconductor
Thermal Calculation and Measurement
7
Thermal Calculation and Measurement
For the following discussions, PD = (VDDL x IDDL) + PI/O, where PI/O is the power dissipation of the I/O drivers.
The VDDSYN power dissipation is negligible.
7.1
Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation:
TJ = TA +(RθJA x PD)
where:
TA = ambient temperature (C)
RθJA = package junction-to-ambient thermal resistance (C/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation
of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor
of two (in the quantity TJ-TA) are possible.
7.2
Estimation with Junction-to-Case Thermal Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal resistance
and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (C/W)
RθJC = junction-to-case thermal resistance (C/W)
RθCA = case-to-ambient thermal resistance (C/W)
RθJC is device related and cannot be influenced by the user. The user adjusts the thermal environment to affect the
case-to-ambient thermal resistance, RθCA. For instance, the user can change the airflow around the device, add a
heat sink, change the mounting arrangement on the printed-circuit board, or change the thermal dissipation on the
printed-circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks
where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most
packages, a better model is required.
7.3
Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model that has demonstrated reasonable accuracy (about 20%) is a two-resistor model
consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case covers the situation
where a heat sink is used or where a substantial amount of heat is dissipated from the top of the package. The
junction-to-board thermal resistance describes the thermal performance when most of the heat is conducted to the
printed-circuit board. It has been observed that the thermal performance of most plastic packages and especially
PBGA packages is strongly dependent on the board temperature; see Figure 3.
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| KMPC860DECZQ50D4 | 功能描述:微处理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| KMPC860DEVR80D4 | 功能描述:微处理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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| KMPC860DEZQ80D4 | 功能描述:微处理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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