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参数资料
| 型号： | KS98-811MG |
| 厂商： | ADVANCED INTERCONNECTIONS CORP |
| 元件分类： | 插座 |
| 英文描述： | DIP8, IC SOCKET |
| 文件页数： | 1/10页 |
| 文件大小： | 400K |
| 代理商： | KS98-811MG |
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 Fax 401-823-8723 Email info@advintcorp.com Internet http://www.advintcorp.com
Peel-A-Way
Dual In-Line Sockets
Page 84
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm
)
Features
:
Peel away terminal carrier after soldering.
Disposable carrier.
Complete soldering visibility on both sides
of PCB.
Maximum air flow.
Better flux rinse.
No contact damage due to terminal carrier
insertion.
No contact pull out due to extraction of
terminal carrier.
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
63% Tin, 37% Lead
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Peel-A-Way
DIP Socket Terminal Carriers
Conforms to NECQ/EIA 540DAAB Standards
Standard High Temperature Sockets
KS -
Insulator Material:
Polyimide Film
Temperature range -269C to 400C (-452F to 752F)
How To Order
KS
3
16
-85
T
G
Body Type
Peel-A-Way DIP
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types.
DIP Spacing
3 - .300" (7.62 mm)
4 - .400" (10.16 mm)
6 - .600" (15.24 mm)
9 - .900" (22.86 mm)
Number of Pins
(8 to 64)
How To Use:
1. Place socket in PCB.
2. Send PCB and socket through soldering operation.
3. Peel away polyimide film carrier.
Polyimide Film
Peel away
after soldering
to PCB.
PCB
Solder fillets visible both sides
for inspection and cleaning.
Peel-A-Way
covered by patent rights issued and/or pending. NECQ = National Electronic Component Qualification System EIA = Electronic Industry Association
cat15
5/22/01
9:42 AM
Page 84
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