参数资料
型号: KW020A0G41-BZ
元件分类: 电源模块
英文描述: 1-OUTPUT 50 W DC-DC REG PWR SUPPLY MODULE
封装: ROHS COMPLIANT
文件页数: 9/24页
文件大小: 2376K
代理商: KW020A0G41-BZ
Preliminary Data Sheet
March 24, 2006
KW010/015/020/025 Series Power Modules:
36 – 75Vdc Input; 1.0 to 5.0Vdc Output; 10 to 25A Output current
Surface Mount Information (continued)
Lead Free Soldering
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
The –Z version of the KW010-025 modules are lead-
free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
R
efl
o
w
T
em
p
C
)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 49.
Figure 49. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Through-Hole Lead-Free Soldering
Information
MSL Rating
The KW010-025 modules have a MSL rating of TBD.
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3
°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210
°C. For Pb solder, the recommended pot
temperature is 260
°C, while the Pb-free solder pot is
270
°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Tyco Electronics
Power System representative for more details.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of
≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Tyco Electronics Board
Tyco Electronics Power Systems
17
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