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| 型号： | KXPC8255CVVIFBC |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 37/41页 |
| 文件大小： | 0K |
| 描述： | IC MPU POWERQUICC II 480-TBGA |
| 标准包装： | 2 |
| 系列： | MPC82xx |
| 处理器类型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 200MHz |
| 电压： | 2.5V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 480-LBGA |
| 供应商设备封装： | 408-TBGA（37.5x37.5） |
| 包装： | 托盘 |
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MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
5
Electrical and Thermal Characteristics
— Up to eight TDM interfaces (4 on the MPC8255)
– Supports two groups of four TDM channels for a total of eight TDMs
– 2,048 bytes of SI RAM
– Bit or byte resolution
– Independent transmit and receive routing, frame synchronization
– Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN
primary rate, Freescale interchip digital link (IDL), general circuit interface (GCI), and
user-defined TDM serial interfaces
— Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs,
SCCs, SMCs, and serial channels
— Four independent 16-bit timers that can be interconnected as two 32-bit timers
2
Electrical and Thermal Characteristics
This section provides AC and DC electrical specifications and thermal characteristics for the MPC8260.
2.1
DC Electrical Characteristics
This section describes the DC electrical characteristics for the MPC8260. Table 1 shows the maximum
electrical ratings.
Table 1. Absolute Maximum Ratings1
1 Absolute maximum ratings are stress ratings only; functional operation (see Table 2) at the maximums is not
guaranteed. Stress beyond those listed may affect device reliability or cause permanent damage.
Rating
Symbol
Value
Unit
Core supply voltage2
2 Caution: VDD/VCCSYN must not exceed VDDH by more than 0.4 V at any time, including during power-on reset.
VDD
-0.3 – 2.75
V
PLL supply voltage2
VCCSYN
-0.3 – 2.75
V
I/O supply voltage3
3 Caution: VDDH can exceed VDD/VCCSYN by 3.3 V during power on reset by no more than 100 mSec. VDDH should
not exceed VDD/VCCSYN by more than 2.0 V during normal operation.
VDDH
-0.3 – 4.0
V
Input voltage4
4 Caution: VIN must not exceed VDDH by more than 2.5 V at any time, including during power-on reset.
VIN
GND(-0.3) – 3.6
V
Junction temperature
Tj
120
°C
Storage temperature range
TSTG
(-55) – (+150)
°C
Note:
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| KXPC8255CZUIFBC | 功能描述:微处理器 - MPU POWERQUICC II HIP3 REV C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| KXPC8255VVIFBC | 功能描述:微处理器 - MPU PQ 2 HIP 3 NO-PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| KXPC8255ZUIFBC | 功能描述:微处理器 - MPU POWERQUICC II HIP3 REV C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| KXPC8260CVVIHBC | 功能描述:微处理器 - MPU PQ 2 HIP 3 NO-PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| KXPC8260CZUIHBC | 功能描述:微处理器 - MPU POWERQUICC II HIP3 REV C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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