参数资料
型号: KXPC8260VVIHBC
厂商: Freescale Semiconductor
文件页数: 2/41页
文件大小: 0K
描述: IC MPU POWERQUICC II 480-TBGA
标准包装: 2
系列: MPC82xx
处理器类型: 32-位 MPC82xx PowerQUICC II
速度: 200MHz
电压: 2.5V
安装类型: 表面贴装
封装/外壳: 480-LBGA
供应商设备封装: 408-TBGA(37.5x37.5)
包装: 托盘
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
10
Freescale Semiconductor
Electrical and Thermal Characteristics
2.2
Thermal Characteristics
Table 4 describes thermal characteristics.
2.3
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (PD x θJA)
(1)
where
TA = ambient temperature °C
θ
JA = package thermal resistance, junction to ambient, °C/W
PD = PINT + PI/O
PINT = IDD x VDD Watts (chip internal power)
PI/O = power dissipation on input and output pins (determined by user)
For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and
TJ is the following:
PD = K/(TJ + 273° C)
(2)
Solving equations (1) and (2) for K gives:
K = PD x (TA + 273° C) + θJA x PD
2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by
solving equations (1) and (2) iteratively for any value of TA.
3 Rev C.2 silicon only.
Table 4. Thermal Characteristics
Characteristics
Symbol
Value
Unit
Air Flow
Thermal resistance for TBGA
θJA
13.071
1 Assumes a single layer board with no thermal vias
°C/W
NC2
2 Natural convection
θJA
9.551
°C/W
1 m/s
θJA
10.483
3 Assumes a four layer board
°C/W
NC
θJA
7.783
°C/W
1 m/s
Note:
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