参数资料
型号: L06032R2CGSTR
厂商: AVX Corporation
文件页数: 5/5页
文件大小: 0K
描述: INDUCTOR THIN FILM 2.2NH 0603
产品目录绘图: Accu-L Series_0603
标准包装: 10
系列: Accu-L®
电感: 2.2nH
电流: 1A
类型: 薄膜
容差: ±0.2nH
屏蔽: 无屏蔽
DC 电阻(DCR): 最大 80 毫欧
Q因子@频率: 49 @ 1.9GHz
频率 - 自谐振: 10GHz
封装/外壳: 0603(1608 公制)
安装类型: 表面贴装
包装: 标准包装
工作温度: -55°C ~ 125°C
频率 - 测试: 450MHz
产品目录页面: 1808 (CN2011-ZH PDF)
其它名称: 478-4328-6
Accu-L ? 0805
Application Notes
HANDLING
SMD chips should be handled with care to avoid damage or
contamination from perspiration and skin oils. The use of
plastic tipped tweezers or vacuum pick-ups is strongly
recommended for individual components. Bulk handling
should ensure that abrasion and mechanical shock are min-
imized. For automatic equipment, taped and reeled product
is the ideal medium for direct presentation to the placement
machine.
CIRCUIT BOARD TYPE
PREHEAT & SOLDERING
The rate of preheat in production should not exceed
4°C/second. It is recommended not to exceed 2°C/
second.
Temperature differential from preheat to soldering should not
exceed 150°C.
For further specific application or process advice, please
consult AVX.
HAND SOLDERING & REWORK
2
All flexible types of circuit boards may be used (e.g. FR-4,
G-10) and also alumina.
For other circuit board materials, please consult factory.
COMPONENT PAD DESIGN
Component pads must be designed to achieve good joints
and minimize component movement during soldering.
Pad designs are given below for both wave and reflow
soldering.
The basis of these designs is:
a. Pad width equal to component width. It is permissible
to decrease this to as low as 85% of component width
but it is not advisable to go below this.
b. Pad overlap about 0.3mm.
c. Pad extension about 0.3mm for reflow.
Pad extension about 0.8mm for wave soldering.
WAVE SOLDERING
DIMENSIONS: millimeters (inches)
Hand soldering is permissible. Preheat of the PCB to 100°C
is required. The most preferable technique is to use hot air
soldering tools. Where a soldering iron is used, a tempera-
ture controlled model not exceeding 30 watts should be
used and set to not more than 260°C. Maximum allowed
time at temperature is 1 minute. When hand soldering, the
base side (white side) must be soldered to the board.
COOLING
After soldering, the assembly should preferably be allowed to
cool naturally. In the event of assisted cooling, similar condi-
tions to those recommended for preheating should be used.
CLEANING RECOMMENDATIONS
Care should be taken to ensure that the devices are thor-
oughly cleaned of flux residues, especially the space beneath
the device. Such residues may otherwise become conduc-
tive and effectively offer a lossy bypass to the device. Various
recommended cleaning conditions (which must be optimized
for the flux system being used) are as follows:
Cleaning liquids . . . . . . i-propanol, ethanol, acetylace-
tone, water, and other standard
PCB cleaning liquids.
1.30
(0.051)
1.2
(0.047)
Ultrasonic conditions . . power – 20w/liter max.
3.1
(0.122)
0.50
(0.020)
1.30
(0.051)
3.8 1.4
(0.150) (0.055)
frequency – 20kHz to 45kHz.
Temperature . . . . . . . . . 80°C maximum (if not otherwise
limited by chosen solvent system).
0.8
(0.031)
0603
Accu-L ?
1.2
(0.047)
0805
Accu-L ?
Time. . . . . . . . . . . . . . . 5 minutes max.
1.5
(0.059)
REFLOW SOLDERING
DIMENSIONS: millimeters (inches)
STORAGE CONDITIONS
Recommended storage conditions for Accu-L ? prior to use
are as follows:
Temperature. . . . . . . . . 15°C to 35°C
2.3
(0.091)
0.90
(0.035)
0.50
(0.020)
0.7
(0.028)
2.8 1.4
(0.110) (0.055)
Humidity . . . . . . . . . . . ≤65%
Air Pressure . . . . . . . . . 860mbar to 1060mbar
0.90
(0.035)
0.8
(0.031)
0603
Accu-L ?
0.7
(0.028)
0805
Accu-L ?
RECOMMENDED SOLDERING
PROFILE
32
1.5
(0.059)
For recommended soldering profile see page 23
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