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参数资料
| 型号： | L0805220JEWTR\3 |
| 厂商： | AVX Corporation |
| 文件页数： | 5/5页 |
| 文件大小： | 0K |
| 描述： | INDUCTOR THIN FILM 22NH 0805 |
| 标准包装： | 10,000 |
| 系列： | Accu-L® |
| 电感： | 22nH |
| 电流： | 500mA |
| 类型： | 薄膜 |
| 容差： | ±5% |
| 屏蔽： | 无屏蔽 |
| DC 电阻(DCR)： | 最大 400 毫欧 |
| Q因子@频率： | 33 @ 900MHz |
| 频率 - 自谐振： | 1.4GHz |
| 封装/外壳： | 0805（2012 公制） |
| 安装类型： | 表面贴装 |
| 包装： | 带卷 (TR) |
| 工作温度： | -55°C ~ 125°C |
| 频率 - 测试： | 450MHz |
Accu-L ? 0805
Application Notes
HANDLING
SMD chips should be handled with care to avoid damage or
contamination from perspiration and skin oils. The use of
plastic tipped tweezers or vacuum pick-ups is strongly
recommended for individual components. Bulk handling
should ensure that abrasion and mechanical shock are min-
imized. For automatic equipment, taped and reeled product
is the ideal medium for direct presentation to the placement
machine.
CIRCUIT BOARD TYPE
PREHEAT & SOLDERING
The rate of preheat in production should not exceed
4°C/second. It is recommended not to exceed 2°C/
second.
Temperature differential from preheat to soldering should not
exceed 150°C.
For further specific application or process advice, please
consult AVX.
HAND SOLDERING & REWORK
2
All flexible types of circuit boards may be used (e.g. FR-4,
G-10) and also alumina.
For other circuit board materials, please consult factory.
COMPONENT PAD DESIGN
Component pads must be designed to achieve good joints
and minimize component movement during soldering.
Pad designs are given below for both wave and reflow
soldering.
The basis of these designs is:
a. Pad width equal to component width. It is permissible
to decrease this to as low as 85% of component width
but it is not advisable to go below this.
b. Pad overlap about 0.3mm.
c. Pad extension about 0.3mm for reflow.
Pad extension about 0.8mm for wave soldering.
WAVE SOLDERING
DIMENSIONS: millimeters (inches)
Hand soldering is permissible. Preheat of the PCB to 100°C
is required. The most preferable technique is to use hot air
soldering tools. Where a soldering iron is used, a tempera-
ture controlled model not exceeding 30 watts should be
used and set to not more than 260°C. Maximum allowed
time at temperature is 1 minute. When hand soldering, the
base side (white side) must be soldered to the board.
COOLING
After soldering, the assembly should preferably be allowed to
cool naturally. In the event of assisted cooling, similar condi-
tions to those recommended for preheating should be used.
CLEANING RECOMMENDATIONS
Care should be taken to ensure that the devices are thor-
oughly cleaned of flux residues, especially the space beneath
the device. Such residues may otherwise become conduc-
tive and effectively offer a lossy bypass to the device. Various
recommended cleaning conditions (which must be optimized
for the flux system being used) are as follows:
Cleaning liquids . . . . . . i-propanol, ethanol, acetylace-
tone, water, and other standard
PCB cleaning liquids.
1.30
(0.051)
1.2
(0.047)
Ultrasonic conditions . . power – 20w/liter max.
3.1
(0.122)
0.50
(0.020)
1.30
(0.051)
3.8 1.4
(0.150) (0.055)
frequency – 20kHz to 45kHz.
Temperature . . . . . . . . . 80°C maximum (if not otherwise
limited by chosen solvent system).
0.8
(0.031)
0603
Accu-L ?
1.2
(0.047)
0805
Accu-L ?
Time. . . . . . . . . . . . . . . 5 minutes max.
1.5
(0.059)
REFLOW SOLDERING
DIMENSIONS: millimeters (inches)
STORAGE CONDITIONS
Recommended storage conditions for Accu-L ? prior to use
are as follows:
Temperature. . . . . . . . . 15°C to 35°C
2.3
(0.091)
0.90
(0.035)
0.50
(0.020)
0.7
(0.028)
2.8 1.4
(0.110) (0.055)
Humidity . . . . . . . . . . . ≤65%
Air Pressure . . . . . . . . . 860mbar to 1060mbar
0.90
(0.035)
0.8
(0.031)
0603
Accu-L ?
0.7
(0.028)
0805
Accu-L ?
RECOMMENDED SOLDERING
PROFILE
32
1.5
(0.059)
For recommended soldering profile see page 23
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相关代理商/技术参数 |
参数描述 |
|---|---|
| L08052R2BESTR | 制造商:AVX Corporation 功能描述:SMD HIGH-Q RF INDUCTOR 0805 2.2NH 制造商:AVX Corporation 功能描述:AVX DESIGN WIN PART LOAD - Tape and Reel |
| L08052R2BEWTR | 功能描述:固定电感器 0.1nH RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| L08052R2CESTR | 功能描述:固定电感器 2.2 NH +-.2NH RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| L08052R2CEWTR | 功能描述:固定电感器 Accu-L 0805 2.2nH RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| L08052R2DESTR | 制造商:AVX Corporation 功能描述: |
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