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参数资料
| 型号： | L6227PD |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 运动控制电子 |
| 英文描述： | STEPPER MOTOR CONTROLLER, 2.8 A, PDSO36 |
| 封装： | POWER, SO-36 |
| 文件页数： | 9/22页 |
| 文件大小： | 389K |
| 代理商： | L6227PD |
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L6227
OUTPUT CURRENT CAPABILITY AND IC POWER DISSIPATION
In Fig. 17 and Fig. 18 are shown the approximate relation between the output current and the IC power dissipa-
tion using PWM current control driving two loads, for two different driving types:
– One Full Bridge ON at a time (Fig.17) in which only one load at a time is energized.
– Two Full Bridges ON at the same time (Fig.18) in which two loads at the same time are energized.
For a given output current and driving type the power dissipated by the IC can be easily evaluated, in order to
establish which package should be used and how large must be the on-board copper dissipating area to guar-
antee a safe operating junction temperature (125°C maximum).
Figure 17. IC Power Dissipation versus Output Current with One Full Bridge ON at a time.
Figure 18. IC Power Dissipation versus Output Current with Two Full Bridges ON at the same time.
THERMAL MANAGEMENT
In most applications the power dissipation in the IC is the main factor that sets the maximum current that can be de-
livered by the device in a safe operating condition. Therefore, it has to be taken into account very carefully. Besides
the available space on the PCB, the right package should be chosen considering the power dissipation. Heat sinking
can be achieved using copper on the PCB with proper area and thickness. Figures 20, 21 and 22 show the Junction-
to-Ambient Thermal Resistance values for the PowerSO36, PowerDIP24 and SO24 packages.
For instance, using a PowerSO package with copper slug soldered on a 1.5 mm copper thickness FR4 board
with 6cm2 dissipating footprint (copper thickness of 35m), the Rth j-amb is about 35°C/W. Fig. 19 shows mount-
ing methods for this package. Using a multi-layer board with vias to a ground plane, thermal impedance can be
reduced down to 15°C/W.
No PW M
fSW = 3 0 kHz (slow decay)
Test Conditions:
Supply Voltage = 24V
I A
I B
IOUT
ONE FULL BRIDGE ON AT A TIME
PD [W]
I OUT [A]
0
0.25 0.5 0.75 1
1.25 1.5
0
2
4
6
8
10
No PWM
fSW = 30 kHz (slow decay)
Test Conditions:
Supply Volt age =24 V
I A
I B
IOUT
PD [W ]
I OUT [A ]
TWO FULL BRIDGES ON AT THE SAME TIME
0
0.25 0.5 0.75
1
1.25 1.5
0
2
4
6
8
10
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相关代理商/技术参数 |
参数描述 |
|---|---|
| L6227PDTR | 功能描述:马达/运动/点火控制器和驱动器 Dual Full Bridge RoHS:否 制造商:STMicroelectronics 产品:Stepper Motor Controllers / Drivers 类型:2 Phase Stepper Motor Driver 工作电源电压:8 V to 45 V 电源电流:0.5 mA 工作温度:- 25 C to + 125 C 安装风格:SMD/SMT 封装 / 箱体:HTSSOP-28 封装:Tube |
| L6227Q | 功能描述:功率驱动器IC DMOS DUAL FULL Bridge w/ PWM RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| L6227Q_09 | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:DMOS dual full bridge driver with PWM current controller |
| L6227QTR | 功能描述:功率驱动器IC DMOS DUAL FULL Bridge w/ PWM RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| L6228 | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:DMOS DRIVER FOR BIPOLAR STEPPER MOTOR |
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