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参数资料
| 型号： | L6316 |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 4 CHANNEL, VIDEO PREAMPLIFIER, UUC33 |
| 封装： | FLIP-CHIP-33 |
| 文件页数： | 3/7页 |
| 文件大小： | 117K |
| 代理商： | L6316 |
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L6316
Figure 3. Flip Chip Pinout Diagram - BUMPS DOWN
Note: Minimum pad pitch = 204 um and pad opening (octagonal) = 70 um
Bump Sequence (see next table for coordinates)
Die dimensions:
X = 2192 ±20 um
Y = 2686 ±20 um
Minimum distance between pads opening center to center:
204um
Wafer thickness:
500 ±20 um
Bump height:
90
±15 um
Bump diameter:
120 ±15 um
Die center misalignment w.r.t original die center after cut:
38 um
Bump material if eutectic:
63% Tin, 37% Lead
Bump material if lead free:
96% Tin, 3.5% Silver, 0.5% Copper
Note: VREF PAD can be left floating or grounded. DO NOT CONNECT IT ANYWHERE ELSE.
TF
VEE GND VCC
HR3Y
HR3X
HW3Y
HW3X
HW2X
HW2Y
HW1Y
HW1X
HW0X
HW0Y
HR2Y
HR1Y
HR2X
HR1X
SDEN
WDY
SCLK
RDX
RDY
SDATA
RXW
FLT
WDX
VEE GND VREF VCC
HR0Y
HR0X
0,0
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