参数资料
型号: L77SDE09S
厂商: Amphenol Commercial Products
文件页数: 97/151页
文件大小: 0K
描述: CONN D-SUB RCPT 9POS GOLD FLASH
产品目录绘图: L77SDE Series-Stamped
标准包装: 50
系列: SD
连接器类型: D-Sub
位置数: 9
行数: 2
外壳尺寸,连接器布局: 1(DE,E)
触点类型:: 信号
连接器类型: 插座,母形插口
安装类型: 自由悬挂
法兰特点: 体座/外壳(无螺纹)
端子: 焊杯
外壳材料,表面处理: 钢,镀锡
触点表面涂层:
触点涂层厚度: 闪光
工作温度: -55°C ~ 125°C
额定电压: 250V
额定电流: 3A
体座材料: 热塑塑胶,玻璃纤维增强型
颜色:
产品目录页面: 296 (CN2011-ZH PDF)
配套产品: L717SDE09P-ND - CONN D-SUB PLUG 9POS GOLD FLASH
相关产品: L17DPPK09JS-ND - CONN D-SUB BACKSHELL 9POS BLACK
L171370-ND - D-SUB BACKSHELL BLACK PLAS 9POS
L17DTZK09KFM-ND - BACKSHELL D-SUB METAL HOOD 9POS
17E-1724-2-ND - CONN BACKSHELL DB9 METAL PLATED
17E-1724-1-ND - CONN BACKSHELL DB9 BLK PLASTIC
17E-1657-09-ND - CONN BACKSHLL DB9 DIE CAST ZINC
97
MINIATURE CARD – MICRO SD CONNECTOR
Specifications:
Contact Resistance: 100 mΩ max at 100 mA
Insulation Resistance: 1000 MΩ min at 500 VDC
Voltage rating: 100V AC
Current Rating: 0.5 A per contact
Dielectric Strenght: 500 VAC/RMS initial and 250 VAC
final at 60 Hz for 1 minute
Operating Temperature: -25°C to +85°C
Materials:
Housing: High Temperature thermoplastic,
UL94V-0 rated
Contact: Copper alloy with selective Au plating,
Tin plated on solder tail
Cover: Copper alloy nickel overall
Part Numbers:
P/N
101-00112-68
101-00139-64
101-00139-68
101-00139-69
101-00240-64
101-00240-68
101-00240-69
101-00349-64
101-00349-68
101-00349-69
101-00303-68
101-00581-59
Description
Micro-SD 8P p-p, w/o C/D, 15 u “ Au plated
Micro-SD 9P p-p, w/ C/D , 1 u “ Au plated
Micro-SD 9P p-p, w/ C/D , 15 u “ Au plated
Micro-SD 9P p-p, w/ C/D , 30 u “ Au plated
Micro-SD 8P, manual, w/ C/D, 1 u “ Au plated
Micro-SD 8P, manual, w/ C/D, 15 u “ Au plated
Micro-SD 8P, manual, w/ C/D, 30 u “ Au plated
Micro-SD 9P p-p, w/ C/D, 1 u “ Au plated
Micro-SD 9P p-p, w/ C/D, 15 u “ Au plated
Micro-SD 9P p-p, w/ C/D, 30 u “ Au plated
Micro SD Hinge Type, 15 u “ Au plated
Micro-SD p-p w/ C/D (Normal Close), 20u “ Au plated
Amphenol InfoCom Europe | www.amphenolinfocom.eu | info@amphenol-nl.com | Specifications subject to change
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