参数资料
型号: LA1654C
厂商: SANYO SEMICONDUCTOR CO LTD
元件分类: 消费家电
英文描述: SPECIALTY CONSUMER CIRCUIT, DSO16
封装: VSON-16
文件页数: 3/5页
文件大小: 101K
代理商: LA1654C
LA1654C
No.A0205-3/5
Chip Specifications
Parameter
Conditions
Ratings
Unit
Chip size
1.26
×2.00
mm
2
Chip thickness
330(
±20)
m
Pad size
127.5
×127.5
m
2
Pad opening
105
×105
m
2
PAD Coordinates
PAD
X-Axis
Y-Axis
PAD
X-Axis
Y-Axis
P1
902
151
TEST PAD
776.5
1849
P2
1109
299.5
P9
368.5
1849
P3A
1109
717.5
P10
151
1747
P3B
1109
508.5
P11
151
1600
P4
1109
926.5
P12
151
1453
P5
1109
1073.5
P13
151
547
P6A
1109
1282.5
P14
151
400
P6B
1109
1491.5
P15
151
253
P7
1109
1700.5
P16
368.5
151
P8
926
1849
Notes
1. The left upper corner of the Pad Layout Diagram on the following page is the origin, the X axis increases to the right
and the Y axis increases in the downward direction.
2. Units :
m
3. The pad coordinates give the coordinate values of the center of the pads.
4. Both of each of the pairs P3A/P3B (VCC) and P6A/P6B (ground) must be bonded.
5. The test pads must not be connected (NC).
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