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参数资料
| 型号： | LA4192 |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 2.3 W, 2 CHANNEL, AUDIO AMPLIFIER, PDIP12 |
| 封装： | DIP-12 |
| 文件页数： | 1/11页 |
| 文件大小： | 407K |
| 代理商： | LA4192 |
Any and all SANYO products described or contained herein do not have specifications that can handle
applications that require extremely high levels of reliability, such as life-support systems, aircraft’s
control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your SANYO representative nearest you before using
any SANYO products described or contained herein in such applications.
SANYO assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges,or other
parameters) listed in products specifications of any and all SANYO products described or contained
herein.
Monolithic Linear IC
1 to 2.3W 2-Channel of Power Amplifier
Ordering number:ENN919D
LA4192
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
21500TH (KT)/71093TS/O207KI/2146KI/4195MW, TS No.919–1/11
Package Dimensions
unit:mm
3022A-DIP12F
[LA4192]
SANYO : DIP12F
Features
Has two channels that can be used for either stereo or
bridge amplifier.
High outputs : LA4192 provides 2.3W per channel for 2
channel stereo connected at VCC=9V,
RL=4, or 4.7W bridge amplifier (for
RL=8).
Voltage gain is variable by externally connected feedback
resistors :
For 2-channel :
RNF=27, VG=50dB
Bridge amplifier connected : RNF=51, VG=51dB
Switching distortions in higher frequencies have been held
low.
The built-in muting circuit keeps noises caused by turn-
ing power on and off at low levels.
The built-in ripple filter provides good ripple rejection
factors.
Excels in channel separation.
Specifications
Absolute Maximum Ratings at Ta = 25C
C
1
6
12
7
3.46
3.5
4.26max
0.51min
19.4
0.81
2.54
5.12
1.3
3.6
0.5
0.4
7.62
6.45
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Note : Basically, this package dissipates heat by using the copper foil section of the printed circuit board, but because power dissipation Pd can be
increased by power voltages and load conditions, it is recommended that a heat sink be used in conjunction with the printed circuit board.
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