
LA49032H
No. A1038-4/12
2. Substrate specifications (substrate recommended for operation of LA49032H)
Size: 90mm × 90mm × 1.6tmm (two-layer substrate [2S0P])
Material: Glass epoxy
Copper wire density: L1=90%/L2=60%
L1: Copper wire pattern diagram
L2: Copper wire pattern diagram
3. Cautions
1) Data for the case with solder mounting on the backside applies to the state where 80% or more of the heat sink
surface is wet.
2) It is advised to make the derating set design with sufficient margin.
Stresses to be derated are the voltage, current, junction temperature, power loss, and mechanical loss including
vibration, impact, and tension.
When designing, therefore, reduce or minimize these stresses as much as possible.
General derating guideline is shown below:
(1) Voltage to be derated to the maximum 80% or less
(2) Current to be derated to the maximum 80% or less
(3) Temperature to be derated to the maximum 80% or less.
3) After set design, be sure to verify the setting with the product.
Check the soldered joint state mainly of the heat sink and radiation fin and verify the reliability of the soldered joint.
Any void or deterioration in the soldered joint of these components, if any, may cause deterioration of thermal
conduction to the substrate, possible resulting in thermal failure of IC. Pay due attention to optimize your use
conditions, substrate land size/mask/printing conditions and to use the solder of composition superior in thermal
fatigue resistance.
Cautions for use
The lightening (power - output short-circuit) and ground fault (GND - output short-circuit) protective circuits are
incorporated, which are activated in case of abnormal connection.
These protective circuits remain active as long as the above abnormal connection continues and are reset automatically
when the abnormality is removed.
The thermal protective circuit is incorporated, which is activated when the junction temperature (Ti) rises to about
160°C or more.
The output is gradually controlled to the attenuated state.
When the product is used near the maximum rating, even the slightest change in the conditions may cause exceeding of
the maximum rating, resulting possibly in failure. Secure the sufficient margin for the supply voltage, etc. to ensure that
the product is used within a range not exceeding the maximum rating under any conditions.