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参数资料
| 型号： | LA4917H |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 7 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO28 |
| 封装： | 0.375 INCH, SOP-28 |
| 文件页数： | 7/8页 |
| 文件大小： | 96K |
| 代理商： | LA4917H |
LA4917H
No.A0322-7/8
Circuit Board Specifications (LA4917H recommended circuit boards)
1) Four-layer circuit board (2S2P)
Board size : 90×90×1.6mm (glass epoxy)
Copper wiring densities : L1 = 60%, L2 = 90%, L3 = 90%, and L4 = 90% (LA4917H mounting surface)
2) Two-layer board (2SOP)
Board size : 90×90×1.6mm (glass epoxy)
Copper wiring densities : L1 = 60% and L2 = 90% (LA4917H mounting surface)
L1 : Copper wiring pattern diagram
L4 (four-layer circuit board),
L2 (two-layer circuit board) :
Copper wiring pattern diagram
Notes
1. The data for the back surface solder mounting case applies when 80% or more of the heat sink surface is wetted.
2. End products must be designed with enough derating to provide adequate margins.
The stresses for which derating must be applied are as follows : voltage, current, junction temperature, power loss and
mechanical stresses such as vibration and shock. Therefore end products must also be designed to keep these stresses as
low or as small as possible.
We present some common derating standards below.
(1) For voltage ratings, 80% or less of the maximum value
(2) For current ratings, 80% or less of the maximum value
(3) For temperature ratings, 80% or less of the maximum value
3. In product design, full testing must be performed in an actual end product.
Furthermore, not only must the solder joint states of heat sinks and heat dissipation fins be checked carefully, but
thorough reliability testing of all solder joints must also be performed. If voids or degradation of the solder joints in
these areas are found, the thermal conductivity with the circuit board will be degraded and this can lead to thermal
destruction of the IC. In such cases, reanalyze the usage conditions, look into optimizing circuit board land dimensions,
masks, and printing conditions, and use a solder with superlative thermal stress resistance.
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