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参数资料
型号： LC51024VG-5F676C
厂商： Lattice Semiconductor Corporation
文件页数： 51/99页
文件大小： 0K
描述： IC XPLD 1024MC 5NS 676FPBGA
标准包装： 27
系列： ispMACH™ 5000VG
可编程类型： 系统内可编程
最大延迟时间 tpd(1)： 5.0ns
电压电源 - 内部： 3 V ~ 3.6 V
逻辑元件/逻辑块数目： 32
宏单元数： 1024
输入/输出数： 384
工作温度： 0°C ~ 90°C
安装类型： 表面贴装
封装/外壳： 676-BBGA
供应商设备封装： 676-FPBGA（31x31）
包装： 托盘
Lattice Semiconductor
ispXPLD 5000MX Family Data Sheet
51
Signals
208 PQFP
4
256 fpBGA
3, 5
484 fpBGA, 5
3
672 fpBGA
3, 5
VCC
10, 49, 76, 114,
153, 180
D4, D13, F6, F11, L6,
L11, N4, N13
A17, A6, AA2, AA21, AB17,
AB6, B2, B21, D19, D4, F1,
F22, G10, G11, G12, G13, K16,
K7, L16, L7, M16, M7, T10,
T11, T12, T13, T14, T9, U1,
U22, W19, W4
AA21, AA6, F21, F6, G20, G7, J13,
J14, K13, K14, L13, L14, M13, M14,
N10, N11, N12, N15, N16, N17, N18,
N9, P10, P11, P12, P15, P16, P17,
P18, P9, R13, R14, T13, T14, U13,
U14, V13, V14, Y20, Y7
VCCO0
5, 17, 189, 204 A1, F7, G6
B9, C3, G8, G9, H7, J2, J7, P4
H10, H11, H8, H9, J8, J9, K8, L8, M8,
N8
VCCO1
42, 57, 72
K6, L7, T1
AA9, R7, T3, T8, Y3
P8, R8, T8, U8, V8, V9, W10, W11,
W8, W9
VCCO2
85, 100, 107,
121
K11, L10, T16
AA14, R16, T15, T20, Y20
P19, R19, T19, U19, V18, V19, W12,
W13, W14, W15, W16, W17, W18,
W19
VCCO3
146, 161, 176
A16, F10, G11
B14, C20, G14, G15, H16, J16,
J21, P19
H12, H13, H14, H15, H16, H17, H18,
H19, J18, J19, K19, L19, M19, N19
VCCP
136
J16
M22
N25
VCCJ
27
J1
M1
N4
GND
15, 29, 44, 81,
119, 148, 185,
7, 19, 191, 205,
40, 56, 70, 87,
101, 109, 123,
144, 160, 174
K1, C3, C14, E5, E12,
G7, G8, G9, G10, H7,
H8, H9, H10, J7, J8, J9,
J10, K7, K8, K9, K10,
M5, M12, P3
N1, A1, A2, A21, A22, AA1,
AA22, AB1, AB22, B1, B22,
C15, C8, D11, D12, E18, E5,
F17, F6, G16, G7, H10, H11,
H12, H13, H14, H15, H20, H3,
H8, H9, J10, J11, J12, J13, J14,
J15, J8, J9, K10, K11, K12,
K13, K14, K15, K8, K9, L10,
L11, L12, L13, L14, L15, L19,
L4, L8, L9, M10, M11, M12,
M13, M14, M19, M4, M9, N10,
N11, N12, N13, N14, N9, P10,
P11, P12, P13, P14, P9, R10,
R11, R12, R13, R14, R15, R8,
R9, T16, T7, W11, W12, Y15,
Y8
A11, A16, A2, A25, AE1, AE2, AE25,
AE26, AF11, AF16, AF2, AF25, B1,
B2, B25, B26, J10, J11, J12, J15, J16,
J17, K10, K11, K12, K15, K16, K17,
K18, K9, L1, L10, L11, L12, L15, L16,
L17, L18, L26, L9, M10, M11, M12,
M15, M16, M17, M18, M9, N13, N14,
P13, P14, R10, R11, R12, R15, R16,
R17, R18, R9, T1, T10, T11, T12,
T15, T16, T17, T18, T26, T9, U10,
U11, U12, U15, U16, U17, U18, U9,
V10, V11, V12, V15, V16, V17
GNDP
134
K16
N22
P26
NC
2
—
5256MX: A2, A11, A12,
A15, B2, B12, B15,
B16, C4, C12, C15,
C16, D1, D11, D14,
D15, D16, E1, E4, E10,
E11, E13, E14, F4, F5,
F12, F13, L1, L4, M3,
M7, M13, N2, N6, P1,
P2, P5, P6, P13, P14,
P15, P16, R1, R2, R4,
R5, R6, R16, T2, T3,
T4, T5, T6
5512MX/5768MX: L1
5512MX: P1, AA19, AB2, AB21,
J17, J6, K1, K17, K18, K19, K2,
K20, K21, K22, K3, K4, K5, K6,
L1, L17, L18, L2, L20, L21, L22,
L3, L5, L6, M15, M17, M18, M2,
M20, M21, M3, M5, M6, M8,
N15, N17, N18, N19, N2, N20,
N21, N3, N4, N5, N6, N8, P15,
P17, P18, P2, P21, P22, P5,
P6, P8, U17, U6, V18, V5, W6
5768MX/51024MX: None
A12, A13, A14, A15, AA10, AA11,
AA12, AA13, AA14, AA15, AA16,
AA17, AA7, AB10, AB11, AB12,
AB13, AB14, AB15, AB16, AB17,
AC10, AC11, AC12, AC13, AC14,
AC15, AC16, AC17, AD11, AD12,
AD13, AD14, AD15, AD16, AE11,
AE12, AE13, AE14, AE15, AE16,
AF12, AF13, AF14, AF15, B11, B12,
B13, B14, B15, B16, C11, C12, C13,
C14, C15, C16, C3, D10, D11, D12,
D13, D14, D15, D16, D17, E10, E11,
E12, E13, E14, E15, E16, E17, E6,
E7, E8, F10, F11, F12, F13, F14, F15,
F16, F17, G10, G11, G12, G13, G14,
G15, G16, G17, Y10, Y11, Y12, Y13,
Y14, Y15, Y16, Y17
1. All grounds must be electrically connected at the board level.
2. NC pins should not be connected to any active signals, VCC or GND.
3. Balls for GND, VCC and VCCOX are connected within the substrate to their respective common signals. Pin orientation A1 starts from the
upper left corner of the top side view with alphabetical order ascending vertically and numerical order ascending horizontally.
4. Pin orientation follows the conventional counter-clockwise order from pin 1 marking of the topside view.
5. Internal GNDs and I/O GNDs (Bank 0 - Bank 3)are connected inside package. VCCO balls connect to four power planes within the pack-
age, one each for VCCOX.
SELECT
DEVICES
DISCONTINUED
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相关代理商/技术参数
参数描述
LC51024VG75F484C 制造商:Lattice Semiconductor Corporation 功能描述:
LC51024VG-75F484C 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
LC51024VG-75F484I 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
LC51024VG-75F676C 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
LC51024VG-75F676I 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
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