参数资料
型号: LC5512MC-75FN256C
厂商: LATTICE SEMICONDUCTOR CORP
元件分类: PLD
中文描述: EE PLD, 9.5 ns, PBGA256
封装: LEAD FREE, FPBGA-256
文件页数: 12/95页
文件大小: 923K
代理商: LC5512MC-75FN256C
Lattice Semiconductor
ispXPLD 5000MX Family Data Sheet
2
Figure 1. ispXPLD 5000MX Block Diagram
Introduction
The ispXPLD 5000MX family represents a new class of device, referred to as the eXpanded Programmable Logic
Devices (XPLDs). These devices extend the capability of Lattice’s popular SuperWIDE ispMACH 5000 architecture
by providing flexible memory capability. The family supports single- or dual-port SRAM, FIFO, and ternary CAM
operation. Extra logic has also been included to allow efficient implementation of arithmetic functions. In addition,
sysCLOCK PLLs and sysIO interfaces provide support for the system-level needs of designers.
The devices provide designers with a convenient one-chip solution that provides logic availability at boot-up, design
security, and extreme reconfigurability. The use of advanced process technology provides industry-leading perfor-
mance with combinatorial propagation delay as low as 4.0ns, 2.8ns clock-to-out delay, 2.2ns set-up time, and oper-
ating frequency up to 300MHz. This performance is coupled with low static and dynamic power consumption. The
ispXPLD 5000MX architecture provides predictable deterministic timing.
The availability of 3.3, 2.5 and 1.8V versions of these devices along with the flexibility of the sysIO interface helps
users meet the challenge of today’s mixed voltage designs. Inputs can be safely driven up to 5.5V when an I/O
bank is configured for 3.3V operation, making this family 5V tolerant. Boundary scan testability further eases inte-
gration into today’s complex systems. A variety of density and package options increase the likelihood of a good fit
for a particular application. Table 1 shows the members of the ispXPLD 5000MX family.
Architecture
The ispXPLD 5000MX devices consist of Multi-Function Blocks (MFBs) interconnected with a Global Routing Pool.
Signals enter and leave the device via one of four sysIO banks. Figure 1 shows the block diagram of the ispXPLD
ISP Port
Global
Routing
Pool
(GRP)
sysCLOCK
PLL 0
sysCLOCK
PLL 1
sysIO
Bank 0
MFB
VCCO3
V
CC
VREF3
VREF2
VCCO2
GCLCK3
GCLK2
RESET
GOE0
GOE1
TDO
GND
TDI
TMS
TCK
PROGRAM
OSA
sysIO
Bank 1
sysIO
Bank 3
sysIO
Bank 2
MFB
OSA
O
SA
VCCO0
VCCO1
VCCP
VREF0
VREF1
GCLCK0
GNDP
GCLK1
Optional
sysCONFIG
Interface
V
CCJ
相关PDF资料
PDF描述
LC51024MC-52FN672C
LC5768MB-75FN256C
LC5512MC-75QN208I
LC51024MC-75FN484C
LC51024MC-52FN484C
相关代理商/技术参数
参数描述
LC5512MC-75FN256I 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
LC5512MC-75FN484C 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
LC5512MC-75FN484I 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
LC5512MC-75FN672C 制造商:LATTICE 制造商全称:Lattice Semiconductor 功能描述:3.3V, 2.5V and 1.8V In-System Programmable eXpanded Programmable Logic Device XPLD⑩ Family
LC5512MC-75FN672I 制造商:LATTICE 制造商全称:Lattice Semiconductor 功能描述:3.3V, 2.5V and 1.8V In-System Programmable eXpanded Programmable Logic Device XPLD⑩ Family