参数资料
型号: LC5768VG-10F256C
厂商: Lattice Semiconductor Corporation
文件页数: 5/99页
文件大小: 0K
描述: IC XPLD 768MC 10NS 256FPBGA
标准包装: 90
系列: ispMACH™ 5000VG
可编程类型: 系统内可编程
最大延迟时间 tpd(1): 10.0ns
电压电源 - 内部: 3 V ~ 3.6 V
逻辑元件/逻辑块数目: 24
宏单元数: 768
输入/输出数: 196
工作温度: 0°C ~ 90°C
安装类型: 表面贴装
封装/外壳: 256-BGA
供应商设备封装: 256-FPBGA(17x17)
包装: 托盘
Lattice Semiconductor
ispXPLD 5000MX Family Data Sheet
9
Table 4. MFB Memory Configuration
Input and Output
The data input and control signals to a MFB in memory mode are generated from inputs from the routing. Data sig-
nals are only available in the true non-inverted format. True or complemented versions of the inputs are available
for generating the control signals. Data and flag outputs are fed from the MFB to the GRP and OSA. Unused inputs
and outputs are not accessible in memory mode.
ROM Operation
In each of the memory modes it is possible to specify the power-on state of each bit in the memory array. This
allows the memory to be used as ROM if desired.
Increased Depth And Width
Designs that require a memory depth or width that is greater than that support by a single MFB can be supported
by cascading multiple blocks. For dual port, single port, and pseudo dual port modes additional width is easily pro-
vided by sharing address lines. Additional depth is supported by multiplexing the RAM output. For FIFO and CAM
modes additional width is supported through the cascading of MFBs.
The Lattice design tools automatically combine blocks to support the memory size specified in the user’s design.
Bus Size Matching
All of the memory modes apart from CAM mode support different widths on each of the ports. The RAM bits are
mapped LSB word 0 to MSB word 0, LSB word 1 to MSB word 1 and so on. Although the word size and number of
words for each port varies this mapping scheme applies to each port.
Memory Mode
Max. Configuration
Size
1
Dual-port
8,192 x 1
4,096 x 2
2,048 x 4
1,024 x 8
512 x 16
Single-port, Pseudo Dual Port, FIFO
16,384 x1
8,192 x 2
4,096 x 4
2,048 x 8
1,024 x 16
512 x 32
CAM
128 x 48
1. Smaller configurations are possible.
SELECT
DEVICES
DISCONTINUED
相关PDF资料
PDF描述
MIC5239-2.5BS TR IC REG LDO 2.5V .5A SOT-223
GEC05DRES-S13 CONN EDGECARD 10POS .100 EXTEND
TAJT475K020RNJ CAP TANT 4.7UF 20V 10% 1210
GCM06DCCT CONN EDGECARD 12POS R/A .156 SLD
ISPLSI 5512VE-80LB388I IC PLD ISP 256I/O 12NS 388BGA
相关代理商/技术参数
参数描述
LC5768VG-10F256I 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
LC5768VG-10F484C 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
LC5768VG-10F484I 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
LC5768VG-12F256I 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
LC5768VG-12F484I 功能描述:CPLD - 复杂可编程逻辑器件 PROGRAM EXPANDED LOG RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100