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参数资料
| 型号： | LC78605E |
| 元件分类： | 消费家电 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP64 |
| 封装： | 14 X 14 MM, QIP-64 |
| 文件页数： | 2/11页 |
| 文件大小： | 94K |
| 代理商： | LC78605E |
No.7735-10/11
LC78605E
Notes on Application Design
While it goes without saying that this IC’s absolute maximum ratings and allowable operating ranges (and
recommended operating conditions) must be strictly observed to achieve reliability as a total system, adequate care is
also required with respect to the operating environment and mounting conditions such as ambient temperature and static
electricity. This section presents notes on items that require care during end product design and IC mounting.
Handling Unused Pins
If any unused input pins on this IC are left open the related internal circuits may become unstable. The instructions on
handling unused pins for specific pins given in the technical documentation must be followed. Also note that unused
output pins must not be shorted to power, ground, or other outputs.
Latchup Prevention
— The stipulated supply voltage must be applied to each power supply pin. If there are multiple pins for which the
same supply voltage is stipulated, the same potential must be applied to all those pins.
— Overvoltages and abnormal noise must not be applied to this IC.
— In general, latchup can be prevented by holding unused input pins fixed at either VDD or VSS. However, the
handling of each pin must follow the specific instruction in the pin functions documentation.
— The outputs must not be shorted.
Interface Notes
When the inputs and outputs of different devices are connected, malfunctions may occur if the input VIL/VIH levels
do not match the corresponding output VOL/VOH levels. Level shifters must be inserted to prevent destruction of the
devices if devices with differing supply voltages, such as may occur in two power supply system applications, are
connected.
Load Capacitance and Output Current
— When connected to high capacitance loads, lines may be melted since the effect of such loads is the same as the
load being shorted for an extended period. Also, charge/discharge currents may result in noise that may degrade
equipment performance and cause malfunctions. The recommended load capacitance ratings must be observed.
— Excessive output sink or source currents can cause similar problems. Observe the maximum allowable power
dissipation ratings and use this IC within the recommended current value range.
Notes on Power Application and Power-on Reset
— There are cases where special care is required at power on, during a reset, and after a reset is cleared. Refer to the
device specifications and design applications taking these concerns into account.
— This IC’s output pin states, I/O settings, and register values are undefined when power is first applied. The
operation of items that are defined by a reset operation or mode settings is only guaranteed after the corresponding
reset or setting operation. A reset must be applied to this IC after power is first applied. The states immediately
after power on of pins and registers that are not explicitly defined cannot be relied on: they may differ from
versions of the same product purchased at different times.
Notes on thermal design
The failure rate of semiconductor devices is accelerated greatly by increases in ambient temperature or power
consumption. To assure high reliability, design the application heat dissipation system to provide adequate margin for
variations in ambient conditions.
Notes on PCB pattern design
— Ideally, there should be separate power supply and ground lines for each system to reduce the influence of shared
impedances.
— The power supply and ground lines should be as wide and as short as possible, and the impedance to high
frequencies should be as small as possible. Ideally, decoupling capacitors (0.01 to 1F) and 100 to 220F
capacitors should be inserted between each power supply/ground pair. However, note that latchup may occur if
the values of these capacitors are too large.
*: In the servo systems, the same handling is required for the VREF reference voltage line as well as for the driver
VCC and ground lines. The driver ground lines must be especially wide and located under the device to provide a
heat dissipating effect.
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