参数资料
型号: LD6806F/30P,115
厂商: NXP Semiconductors
文件页数: 30/36页
文件大小: 0K
描述: IC REG LDO 200MA 3.0V 6XSON
标准包装: 5,000
系列: *
NXP Semiconductors
LD6806 series
Ultra low-dropout regulator, low noise, 200 mA
16.2 PCB assembly guidelines for Pb-free soldering
Table 19.
Parameter
Assembly recommendations
Value or specification
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder to flux ratio
Solder reflow profile
T
( ° C)
T reflow(peak)
250
230
217
preheat
250 ? m
100 ? m (0.004 inch)
SnAg (3 % to 4 %); Cu (0.5 % to 0.9 %)
50 : 50
cooling rate
t 1
t 2
t (s)
t 3
t 4
t 5
001aai943
The device is capable of withstanding at least three reflows at this profile.
Fig 45. Pb-free solder reflow profile
Table 20.
Characteristics
Symbol
T reflow(peak)
t 1
t 2
t 3
t 4
t 5
dT/dt
Parameter
peak reflow temperature
time 1
time 2
time 3
time 4
time 5
rate of change of
temperature
Conditions
soak time
time during T ? 250 ? C
time during T ? 230 ? C
time during T > 217 ? C
cooling rate
preheat
Min
230
60
-
10
30
-
-
2.5
Typ
-
-
-
-
-
-
-
-
Max
260
180
30
50
150
540
? 6
4.0
Unit
? C
s
s
s
s
s
? C/s
? C/s
LD6806_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 9 December 2011
? NXP B.V. 2011. All rights reserved.
30 of 36
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