参数资料
型号: LDS8680008-T2
厂商: IXYS
文件页数: 6/12页
文件大小: 0K
描述: IC LED DRIVER PHOTO FLASH 16WQFN
标准包装: 1
系列: PowerLite™
拓扑: 线性(LDO),切换式电容器(充电泵)
输出数: 2
内部驱动器:
类型 - 主要: 闪灯/白光
类型 - 次要: 高亮度 LED(HBLED)
电源电压: 2.7 V ~ 5.5 V
安装类型: 表面贴装
封装/外壳: 16-WFQFN 裸露焊盘
供应商设备封装: 16-TQFN
包装: 标准包装
其它名称: LDS8680-002-T5-6
LDS8680-002-T5-6-ND
LDS8680008-T2-6
LDS8680
PIN DESCRIPTION
Pin #
1
2
3
4
5
6
Name
V IN
C1+
C1-
EN/SET
LEDB
LEDA
Function
Charge pump input, connect to battery or supply
Flying capacitor 1 Positive terminal
Flying capacitor 1 Negative terminal
Device enable (active high) and Dimming Control
LEDB cathode terminal
LEDA cathode terminal
7
8
PAD
GND
V OUT
PAD
Ground Reference
Charge pump output connected to the LED anodes
Connect to GND on the PCB
Top view: TDFN 8-lead 2 X 3 mm
PIN FUNCTION
V IN is the supply pin for the charge pump. A small
1 μ F ceramic bypass capacitor is required between
the V IN pin and ground near the device. The
operating input voltage range is from 2.7 V to 5.5 V. If
V IN falls below the under-voltage threshold, all LED
channels disable and the device enters shutdown
mode.
EN/SET is the enable and one wire addressable
control logic input for all LED channels. Guaranteed
levels of logic high and logic low are set at 1.4 V and
0.4 V respectively. When EN/SET is initially taken
high, the device becomes enabled and all LED
currents remain at 0 mA. To start LED current, device
should be in PWM mode (See p. 5). To place the
device into zero current mode, the EN/SET pin must
be held low for more than 50 ms.
V OUT is the charge pump output that is connected to
the LED anodes. A small 2.2 μ F ceramic bypass
capacitor is required between the V OUT pin and
ground near the device.
GND is the ground reference for the charge pump.
The pin must be connected to the ground plane on
the PCB.
C1+, C1- are connected to each side of the ceramic
flying capacitor C1
LEDA, LEDB provides the internal regulated current
source for each of the LED cathodes. These pins
enter high-impedance zero current state whenever
the device is in shutdown mode.
PAD is the exposed pad underneath the packag e.
For best thermal performance, the pad should be
soldered to the PCB and connected to the ground
plane
? 2009 IXYS Corp.
Characteristics subject to change without notice
6
Doc. No. 8680_DS, Rev. N1.0
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