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参数资料
| 型号： | LI0201C330R-10 |
| 厂商： | LAIRD TECHNOLOGIES |
| 元件分类： | 数据传输滤波器 |
| 英文描述： | 1 FUNCTIONS, 0.3 A, FERRITE CHIP |
| 封装： | ROHS COMPLIANT, EIA STD PACKAGE SIZE 0603, 2 PIN |
| 文件页数： | 5/6页 |
| 文件大小： | 1376K |
| 代理商： | LI0201C330R-10 |
global solutions: local support
TM
Innovative Technology
for a Connected World
LI0201
Ferrite Chip Beads
Application Notes
USA: +1 800 634.2673
+1 423 308.1690
Europe: +49 8031.2460.0
Asia: +86 755.2714.1166
www.lairdtech.com
LEAD-FREE/ROHS COMPLIANCE
All Laird Technologies’ surface mount and through hole EMI components (including assemblies with wire and cofired monolithic ferrite
chip beads and common mode chokes) are available lead-free and RoHS compliant.
PART NUMBERING SYSTEM
Lead-free board level part numbers are differentiated by a suffix descriptor. The suffix (-10) identifies the part number for all lead-free
parts. This part number suffix is for use on board level part numbers only.
PART NUMBER EXAMPLES
Old Part
HZ0805E601R-00
contains lead
Old Part
28F0121-0SR
contains lead
New Part
HZ0805E601R-10
is lead-free
New Part 28F0121-0SR-10 is lead-free
All Laird Technologies’ new and old ferrite cable cores are RoHS compliant. No part number change for cable cores.
COMPOSITION
Laird Technologies’ lead-free component terminations and wire platings are 100% matte Tin (Sn) over a Nickel (Ni) barrier and are
reverse compatible with existing Tin (Sn)/Lead (Pb) materials.
Concerns over the use of pure tin coatings on component leads and terminations, due to the possibility of tin whiskering, are still under
industry discussion. Electroplating 100% matte tin over a nickel barrier is recognized as an effective whisker growth mitigation strategy
that is accepted by most industry groups. Laird Technologies’ maintains a minimum plating thickness of 2.5m [99in] of Tin, and
0.7m [28in] of Nickel.
RECOMMENDED LEAD-FREE
SOLDERING PROFILE
While Laird Technologies’ lead-free surface mount and
through hole components are reverse compatible with
existing Sn/Pb materials, higher peak temperatures (up to
260°C) provide better wetting characteristics during the
solder reflow process. The higher reflow temperatures
typically used for lead-free processes will not damage
Laird Technologies’ surface mount components, but
the delta T between the board and larger components
must be considered. Smaller delta Ts can be achieved
with slower belt speed to increase the pre-heat time.
Soldering cycle time (throughput) must be balanced with
reflow temperature. Allowance must be made for the
coldest part (largest heat sink) to solder, considering the
thermal mass of the board and size of the components.
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| LI0402E600R-00 | 1 FUNCTIONS, 75 V, 0.5 A, FERRITE CHIP |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LI0201C560R-10 | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 56ohms 100MHz .3A 0201 RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| LI0201C800R-10 | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 80ohms 100MHz .3A 0201 RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| LI0201E100R-10 | 制造商:Laird Technologies Inc 功能描述:- Tape and Reel |
| LI0201E800R-10 | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 80ohms 100MHz .5A 0201 RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| LI-03/B | 制造商:Gentech International Ltd 功能描述:Bulk |
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