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参数资料
| 型号： | LISY300ALTR |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 模拟信号调理 |
| 英文描述： | TEMPERATURE SENSOR, PBCC28 |
| 封装： | 7 X 7 MM, 1.50 MM HEIGHT, GREEN, PLASTIC, LGA-28 |
| 文件页数： | 3/13页 |
| 文件大小： | 171K |
| 代理商： | LISY300ALTR |
LISY300AL
Package information
11/13
4
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 4.
LGA-28: mechanical data and package dimensions
OUTLINE AND
MECHANICAL DATA
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
1.600
0.0630
A2
1.300
0.0512
A3
0.170
0.200
0.230 0.0067 0.0079 0.0091
D
6.900
7.000
7.100 0.2717 0.2756 0.2795
E
6.900
7.000
7.100 0.2717 0.2756 0.2795
F
0.350
0.0138
G
0.800
0.0315
L
0.450
0.0177
L1
0.100
0.0039
M
0.800
0.0315
N
1.600
0.0630
O
4.800
0.1890
P
2.400
0.0945
K
0.050
0.0020
LGA28 (7x7x1.5mm)
Land Grid Array Package
8003444 A
OUTLINE AND
MECHANICAL DATA
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
1.600
0.0630
A2
1.300
0.0512
A3
0.170
0.200
0.230 0.0067 0.0079 0.0091
D
6.900
7.000
7.100 0.2717 0.2756 0.2795
E
6.900
7.000
7.100 0.2717 0.2756 0.2795
F
0.350
0.0138
G
0.800
0.0315
L
0.450
0.0177
L1
0.100
0.0039
M
0.800
0.0315
N
1.600
0.0630
O
4.800
0.1890
P
2.400
0.0945
K
0.050
0.0020
LGA28 (7x7x1.5mm)
Land Grid Array Package
8003444 A
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